Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4963-1M
MA001396910
PG-SOT23-3-15
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.220
0.001
0.004
0.011
3.590
0.023
0.055
1.181
4.257
0.152
0.149
0.024
0.113
Average
Mass
[%]
2.25
0.01
0.04
0.11
36.71
0.24
0.56
12.08
43.54
1.55
1.52
0.24
1.15
24. August 2015
9.78 mg
Sum
[%]
2.25
Average
Mass
[ppm]
22458
74
369
1106
36.87
0.24
367146
2360
5618
120790
56.18
1.55
1.52
435405
15496
15197
2447
1.39
11534
13981
1000000
561813
15496
15197
368695
2360
Sum
[ppm]
22458
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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