Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLI4970-D050T5
MA001396736
PG-TISON-8-1
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
plastics
inorganic material
< 10%
Substances
silicon
chromium
tin
zinc
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
epoxy resin
silicondioxide
CAS#
if applicable
7440-21-3
7440-47-3
7440-31-5
7440-66-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
-
60676-86-0
Issued
Weight*
Weight
[mg]
3.226
0.123
0.102
0.082
40.635
0.265
0.174
10.683
75.998
1.143
0.090
0.131
0.131
0.262
Average
Mass
[%]
2.42
0.09
0.08
0.06
30.54
0.20
0.13
8.03
57.12
0.86
0.07
0.10
0.10
0.20
4. August 2015
133.04 mg
Sum
[%]
2.42
Average
Mass
[ppm]
24244
923
769
615
30.77
0.20
305424
1991
1306
80298
65.28
0.86
0.07
571225
8589
676
985
985
0.40
1970
3940
1000000
652829
8589
676
307731
1991
Sum
[ppm]
24244
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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