Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLF50281EL
MA001048696
PG-SSOP-14-3
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.105
0.009
0.034
0.689
27.978
0.213
0.097
4.440
43.722
0.976
0.768
0.383
1.150
Average
Mass
[%]
3.72
0.01
0.04
0.82
33.48
0.25
0.12
5.31
52.32
1.17
0.92
0.46
1.38
28. August 2013
83.56 mg
Sum
[%]
3.72
Average
Mass
[ppm]
37154
103
412
8246
34.35
0.25
334809
2544
1155
53131
57.75
1.17
0.92
523223
11681
9186
4589
1.84
13767
18356
1000000
577509
11681
9186
343570
2544
Sum
[ppm]
37154
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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