Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLF4949EJ
MA001001408
PG-DSO-8-52
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.577
0.009
0.036
0.728
29.548
0.076
0.102
4.686
46.145
0.695
0.725
0.069
0.206
Average
Mass
[%]
0.69
0.01
0.04
0.87
35.34
0.09
0.12
5.60
55.21
0.83
0.87
0.08
0.25
28. August 2013
83.60 mg
Sum
[%]
0.69
Average
Mass
[ppm]
6902
109
435
8705
36.26
0.09
353440
907
1218
56050
60.93
0.83
0.87
551968
8315
8666
821
0.33
2464
3285
1000000
609236
8315
8666
362689
907
Sum
[ppm]
6902
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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