Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE9833QX
MA000985218
PG-VQFN-48-29
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.983
0.018
0.072
1.433
58.193
0.782
0.181
7.656
52.446
2.596
0.614
0.286
0.958
Average
Mass
[%]
3.83
0.01
0.06
1.10
44.68
0.60
0.14
5.88
40.28
1.99
0.47
0.22
0.74
28. August 2013
130.22 mg
Sum
[%]
3.83
Average
Mass
[ppm]
38268
138
550
11006
45.85
0.60
446885
6009
1389
58792
46.30
1.99
0.47
402751
19939
4714
2199
0.96
7360
9559
1000000
462932
19939
4714
458579
6009
Sum
[ppm]
38268
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com