Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4998P4
MA000863066
PG-SSO-4-1
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
chromium
titanium
silver
tin
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-47-3
7440-32-6
7440-22-4
7440-31-5
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.696
0.229
0.229
0.305
0.458
75.040
0.052
0.203
0.253
0.506
4.608
19.748
7.027
0.655
0.163
0.650
Average
Mass
[%]
2.39
0.20
0.20
0.27
0.41
66.52
0.05
0.18
0.22
0.45
4.08
17.50
6.23
0.58
0.14
0.58
28. August 2013
112.82 mg
Sum
[%]
2.39
Average
Mass
[ppm]
23896
2028
2028
2704
4056
67.60
0.05
665125
459
1795
2244
4488
40843
22.43
6.23
0.58
175040
62286
5805
1441
0.72
5762
7203
1000000
224410
62286
5805
675941
459
Sum
[ppm]
23896
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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