Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4942-1C
MA000862102
PG-SSO-2-4
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
inorganic material
inorganic material
inorganic material
plastics
inorganic material
noble metal
noble metal
inorganic material
Substances
silicon
chromium
titanium
silver
tin
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
leadoxide
titandioxide
leadtitanate
epoxy resin
bismuth trioxide
palladium
silver
bariumtitanate
CAS#
if applicable
7440-21-3
7440-47-3
7440-32-6
7440-22-4
7440-31-5
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
1317-36-8
13463-67-7
12060-00-3
-
1304-76-3
7440-05-3
7440-22-4
12047-27-7
Issued
Weight*
Weight
[mg]
2.458
0.288
0.288
0.384
0.576
94.449
0.060
0.450
0.563
1.125
10.238
43.878
6.247
0.986
0.153
0.613
0.001
0.148
0.031
0.002
0.255
0.474
1.499
3.790
Average
Mass
[%]
1.46
0.17
0.17
0.23
0.34
55.89
0.04
0.27
0.33
0.67
6.06
25.97
3.70
0.58
0.09
0.36
0.00
0.09
0.02
0.00
0.15
0.28
0.89
2.24
28. August 2013
168.96 mg
Sum
[%]
1.46
Average
Mass
[ppm]
14550
1704
1704
2272
3409
56.80
0.04
559019
353
2664
3329
6659
60597
33.30
3.70
0.58
259700
36973
5834
908
0.45
3631
7
876
183
12
1509
2806
8872
3.67
22429
36694
1000000
4539
332949
36973
5834
568108
353
Sum
[ppm]
14550
wire
encapsulation
leadfinish
plating
glue
smd
*deviation
< 10%
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
