Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
TDA5102
MA000220800
PG-TSSOP-16-1
Material Group
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
nickel
iron
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.497
8.109
11.199
0.447
0.108
4.573
31.330
0.915
0.856
0.163
0.578
Average
Mass
[%]
2.50
13.57
18.73
0.75
0.18
7.65
52.42
1.53
1.43
0.27
0.97
28. August 2013
59.78 mg
Sum
[%]
2.50
Average
Mass
[ppm]
25037
135665
32.30
0.75
187347
7472
1807
76512
60.25
1.53
1.43
524135
15304
14327
2727
1.24
9667
12394
1000000
602454
15304
14327
323012
7472
Sum
[ppm]
25037
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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