HN58X2504FPI概述

512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

HN58X2504FPI规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
零件包装代码	SOIC
包装说明	SOP, SOP8,.25
针数	8
Reach Compliance Code	unknow
ECCN代码	EAR99
最大时钟频率 (fCLK)	3 MHz
数据保留时间-最小值	10
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e0
长度	4.89 mm
内存密度	4096 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	512 words
字数代码	512
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	512X8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2/5 V
认证状态	Not Qualified
座面最大高度	1.73 mm
串行总线类型	SPI
最大待机电流	0.000003 A
最大压摆率	0.0025 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.8 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN LEAD
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	3.9 mm
最长写入周期时间 (tWC)	8 ms
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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HN58X2502I

HN58X2504I

Serial Peripheral Interface

2k EEPROM (256-kword

8-bit)

4k EEPROM (512-kword

8-bit)

Electrically Erasable and Programmable Read Only Memory

REJ03C0061-0001Z

Preliminary

Rev. 0.01

Jul. 29, 2003

Description

HN58X25xxx Series is the Serial Peripheral Interface (SPI) EEPROM (Electrically Erasable and

Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by

employing advanced MONOS memory technology and CMOS process and low voltage circuitry technology.

It also has a 16-byte page programming function to make it’s write operation faster.

Note: Renesas Technology’s serial EEPROM are authorized for using consumer applications such as

cellular phones, camcorders, audio equipments. Therefore, please contact Renesas Technology’s

sales office before using industrial applications such as automotive systems, embedded controllers,

and meters.

Preliminary: The specifications of this device are subject to change without notice. Please contact your

nearest Renesas Technology’s Sales Dept. regarding specifications.

Rev.0.01, Jul.29.2003, page 1 of 29

HN58X2504FPI相似产品对比

	HN58X2504FPI	HN58X2504NI	HN58X2502TI	HN58X2504TI	HN58X2502FPI
描述	512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8	512X8 SPI BUS SERIAL EEPROM, DSO8, PLASTIC, SON-8	256X8 SPI BUS SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8	512X8 SPI BUS SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8	256X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8
是否Rohs认证	不符合	不符合	不符合	不符合	不符合
零件包装代码	SOIC	SON	SOIC	SOIC	SOIC
包装说明	SOP, SOP8,.25	VSON, FL8,.15,25	TSSOP, TSSOP8,.25	TSSOP,	SOP, SOP8,.25
针数	8	8	8	8	8
Reach Compliance Code	unknow	unknown	unknown	unknown	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99
最大时钟频率 (fCLK)	3 MHz	3 MHz	3 MHz	3 MHz	3 MHz
JESD-30 代码	R-PDSO-G8	R-XDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e0	e0	e0	e0	e0
长度	4.89 mm	3.6 mm	4.4 mm	4.4 mm	4.89 mm
内存密度	4096 bi	4096 bit	2048 bit	4096 bit	2048 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8
功能数量	1	1	1	1	1
端子数量	8	8	8	8	8
字数	512 words	512 words	256 words	512 words	256 words
字数代码	512	512	256	512	256
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	512X8	512X8	256X8	512X8	256X8
封装主体材料	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	VSON	TSSOP	TSSOP	SOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.73 mm	0.8 mm	1.1 mm	1.1 mm	1.73 mm
串行总线类型	SPI	SPI	SPI	SPI	SPI
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	3.9 mm	3 mm	3 mm	3 mm	3.9 mm
最长写入周期时间 (tWC)	8 ms	8 ms	8 ms	8 ms	8 ms
是否无铅	含铅	-	含铅	含铅	含铅
数据保留时间-最小值	10	10	10	-	10
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-	100000 Write/Erase Cycles
封装等效代码	SOP8,.25	FL8,.15,25	TSSOP8,.25	-	SOP8,.25
电源	2/5 V	2/5 V	2/5 V	-	2/5 V
最大待机电流	0.000003 A	0.000003 A	0.000003 A	-	0.000003 A
最大压摆率	0.0025 mA	0.0025 mA	0.0025 mA	-	0.0025 mA
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE
Base Number Matches	1	1	1	-	-
厂商名称	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)

HN58X2504FPI

HN58X2504FPI概述

HN58X2504FPI规格参数

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HN58X2504FPI相似产品对比

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