IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | FBGA, BGA10,3X4,20 |
Reach Compliance Code | compliant |
控制模式 | VOLTAGE-MODE |
JESD-30 代码 | R-PBGA-B10 |
JESD-609代码 | e1 |
湿度敏感等级 | 1 |
端子数量 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -30 °C |
最大输出电流 | 0.45 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装等效代码 | BGA10,3X4,20 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH |
认证状态 | Not Qualified |
表面贴装 | YES |
最大切换频率 | 750 kHz |
温度等级 | OTHER |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
LM3661TL-1.4 | LM3661TL-1.35/NOPB | LM3661TLX-1.35/NOPB | LM3661TLX-1.4/NOPB | LM3661TLX-1.4 | LM3661TL-1.4/NOPB | |
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描述 | IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,VOLTAGE-MODE,BGA,10PIN,PLASTIC |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
控制模式 | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE |
JESD-30 代码 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 |
JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 10 | 10 | 10 | 10 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
最大输出电流 | 0.45 A | 0.45 A | 0.45 A | 0.45 A | 0.45 A | 0.45 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
封装等效代码 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | YES |
最大切换频率 | 750 kHz | 750 kHz | 750 kHz | 750 kHz | 750 kHz | 750 kHz |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
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