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IDT72V15165L15TFGI8

产品描述FIFO, 4KX16, 10ns, Synchronous, PQFP64, STQFP-64
产品类别存储    存储   
文件大小123KB,共8页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT72V15165L15TFGI8概述

FIFO, 4KX16, 10ns, Synchronous, PQFP64, STQFP-64

IDT72V15165L15TFGI8规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明STQFP-64
针数64
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间10 ns
周期时间15 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e3
长度10 mm
内存密度65536 bit
内存宽度16
功能数量1
端子数量64
字数4096 words
字数代码4000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4KX16
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度10 mm

文档预览

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3.3 VOLT MULTIMEDIA FIFO
256 x 16, 512 x 16,
1,024 x 16, 2,048 x 16,
and 4,096 x 16
IDT72V11165, IDT72V12165
IDT72V13165, IDT72V14165
IDT72V15165
FEATURES
DESCRIPTION
The IDT72V11165/72V12165/72V13165/72V14165/72V15165 devices
are First-In, First-Out (FIFO) memories with clocked read and write controls.
These FIFOs have 16-bit input and output ports. The input port is controlled
by a free-running clock (WCLK), and an input enable pin (WEN). Data is written
into the Multimedia FIFO on every clock when
WEN
is asserted. The output port
is controlled by another clock pin (RCLK) and another enable pin (REN). The
Read Clock (RCLK) can be tied to the Write Clock for single clock operation or
the two clocks can run asynchronous of one another for dual-clock operation.
An Output Enable pin (OE) is provided on the read port for three-state control
of the output.
These Multimedia FIFOs support three fixed flags: Empty Flag (EF), Full
Flag (FF), and Half Full Flag (HF).
256 x 16-bit organization array (IDT72V11165)
512 x 16-bit organization array (IDT72V12165)
1,024 x 16-bit organization array (IDT72V13165)
2,048 x 16-bit organization array (IDT72V14165)
4,096 x 16-bit organization array (IDT72V15165)
15 ns read/write cycle time
5V input tolerant
Independent Read and Write Clocks
Empty/Full and Half-Full flag capability
Output enable puts output data bus in high-impedance state
Available in a 64-lead thin quad flatpack (10x10mm and 14x14mm
TQFP)
Industrial temperature range (–40°C to +85°C)
°
°
FUNCTIONAL BLOCK DIAGRAM
WCLK
WEN
WRITE
CONTROL
READ
CONTROL
RCLK
REN
FIFO ARRAY
D
0
- D
15
Data In
x16
OE
Q
0
- Q
15
Data Out
x16
RESET LOGIC
FLAG OUTPUTS
RS
EF
HF
FF
6359 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
DSC-6359/2

IDT72V15165L15TFGI8相似产品对比

IDT72V15165L15TFGI8 IDT72V12165L15TFGI8 IDT72V13165L15TFGI8 IDT72V11165L15TFGI8 IDT72V14165L15TFGI8
描述 FIFO, 4KX16, 10ns, Synchronous, PQFP64, STQFP-64 FIFO, 512X16, 10ns, Synchronous, PQFP64, STQFP-64 FIFO, 1KX16, 10ns, Synchronous, PQFP64, STQFP-64 FIFO, 256X16, 10ns, Synchronous, PQFP64, STQFP-64 FIFO, 2KX16, 10ns, Synchronous, PQFP64, STQFP-64
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP QFP
包装说明 STQFP-64 LFQFP, LFQFP, LFQFP, STQFP-64
针数 64 64 64 64 64
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 10 ns 10 ns 10 ns 10 ns 10 ns
周期时间 15 ns 15 ns 15 ns 15 ns 15 ns
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609代码 e3 e3 e3 e3 e3
长度 10 mm 10 mm 10 mm 10 mm 10 mm
内存密度 65536 bit 8192 bit 16384 bit 4096 bit 32768 bit
内存宽度 16 16 16 16 16
功能数量 1 1 1 1 1
端子数量 64 64 64 64 64
字数 4096 words 512 words 1024 words 256 words 2048 words
字数代码 4000 512 1000 256 2000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
组织 4KX16 512X16 1KX16 256X16 2KX16
可输出 YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30
宽度 10 mm 10 mm 10 mm 10 mm 10 mm

 
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