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GS8170D36B-300I

产品描述Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
产品类别存储    存储   
文件大小1MB,共32页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
下载文档 详细参数 全文预览

GS8170D36B-300I概述

Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8170D36B-300I规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA, BGA209,11X19,40
针数209
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间1.8 ns
其他特性PIPELINED ARCHITECTURE
I/O 类型COMMON
JESD-30 代码R-PBGA-B209
JESD-609代码e0
长度22 mm
内存密度18874368 bit
内存集成电路类型STANDARD SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量209
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA209,11X19,40
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源1.5/1.8,1.8 V
认证状态Not Qualified
座面最大高度1.7 mm
最小待机电流1.7 V
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm

文档预览

下载PDF文档
Preliminary
GS8170D18/36B-333/300/250
209-Bump BGA
Commercial Temp
Industrial Temp
18Mb
Σ
1x2Lp DDR SRAM
1M x 18, 512K x 36
250 - 333 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Features
• Double Data Rate Read and Write mode
• JEDEC standard SigmaRAM
pinout and package
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V I/O supply
• Pipelined read operation.
• Fully coherent read and write pipelines
• Echo Clock outputs track data output drivers
• ZQ mode pin for user-selectable output drive strength
• 2 User programmable chip enable inputs for easy depth
expansion.
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
• Pin compatible with future 32M, 64M, and 128M devices
SigmaRAM Family Overview
GS8170D18/36 SigmaRAMs are built in compliance with the
SigmaRAM pinout standard for synchronous SRAMs.
18,874,368-bit (18Mb) SRAMs. These are the first in a family
of wide, very low voltage CMOS I/O SRAMs designed to
operate at the speeds needed to implement economical high
performance networking systems.
GSI's
ΣRAMs
are offered in a number of configurations that
emulate other synchronous SRAMs, such as Burst RAMs,
NBT, Late Write, or Double Data Rate (DDR) SRAMs. The
logical differences between the protocols employed by these
RAMs hinge mainly on various combinations of address
bursting, output data registering and write cueing. The
ΣRAM
family standard allows a user to implement the
interface protocol best suited to the task at hand.
Bottom View
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
Because the DDR
ΣRAM
always transfers data in two halves,
A0 is internally set to 0 for the first half of each read or write
transfer, and automatically incremented to 1 for the falling
edge transfer. The address field of a DDR
ΣRAM
is always one
address pin less than the advertised index depth (e.g., the 1M x
18 has a 512k addressable index).
In Pipeline mode, single data rate
ΣRAMs
incorporate a rising-
edge-triggered output register. In DDR mode, rising- and
falling-edge-triggered output registers are employed. For read
cycles, a DDR SRAM’s output data is staged at the input of an
edge-triggered output register during the access cycle and then
released to the output drivers at the next rising and subsequent
falling edge of clock.
GS817x18/36/72B
ΣRAMs
are implemented with GSI's high
performance CMOS technology and are packaged in a 209-
bump BGA.
Functional Description
Because SigmaRAMs are synchronous devices, address, and
read/write control inputs are captured on the rising edge of the
input clock. Write cycles are internally self-timed and initiated
by the rising edge of the clock input. This feature eliminates
complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing. In
DDR mode the device captures Data In on both rising and
falling edges of clock and drives data on both clock edges as
well.
Rev: 1.04b 06/2001
1/32
© 2001, GSI Technology, Inc.
D
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
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