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SMBG5915BE3

产品描述Zener Diode, 3.9V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-215AA, ROHS COMPLIANT, PLASTIC, SMBG, 2 PIN
产品类别分立半导体    二极管   
文件大小387KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

SMBG5915BE3概述

Zener Diode, 3.9V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-215AA, ROHS COMPLIANT, PLASTIC, SMBG, 2 PIN

SMBG5915BE3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-215AA
包装说明ROHS COMPLIANT, PLASTIC, SMBG, 2 PIN
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-215AA
JESD-30 代码R-PDSO-G2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
标称参考电压3.9 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5%
工作测试电流96.1 mA

文档预览

下载PDF文档
SMBG5913 – SMBG5956e3,
SMBJ5913 – SMBJ5956e3
Available
Silicon 2.0 Watt Zener Diodes
DESCRIPTION
The SMB(G/J)5913B – SMB(G/J)5956B series of surface mount 2.0 watt Zener diodes
provides a selection from 3.3 to 200 volts with tolerance options of 10%, 5% and 2%. This
series has the same electrical characteristics as the axial, JEDEC registered 1N5913 -
1N5956 series with the exception of its higher, 2.0 W power rating (versus 1.5 W for the
JEDEC series). This is permitted by the lower thermal resistance of the surface mount
packaging. The SMBG Gull-wing design in the DO-215AA package provides for visible solder
connections. The SMBJ J-bend design in the DO-214AA package permits greater PC board
mounting density. The series is available with SnPb plated leaded or RoHS compliant matte-
tin plating.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-215AA
Gull-wing Package
FEATURES
Surface mount equivalent to JEDEC registered 1N5913 thru 1N5956 number series but with a 30%
higher power rating.
Ideal for high-density and low-profile mounting.
Zener voltage available 3.3 V to 200 V.
Standard voltage tolerances are plus/minus 10%, 5% and 2%.
RoHS compliant versions available.
DO-214AA
J-bend Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Withstands high surge stresses (see
figure 2).
Minimal changes of voltage versus current.
High specified maximum current (I
ZM
) when adequately heat sunk.
Moisture classification is Level 1 per IPC/JEDEC J-STD-020B with no dry pack required.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
Thermal Resistance Junction-to-Ambient
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
(1)
o
(2)
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +150
35
100
2.0
1.2
260
Unit
o
o
o
C
C/W
C/W
W
V
o
Steady-State Power Dissipation @ TL < 80 C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
C
Notes:
1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
last page).
2. Or 1.25 watts at T
A
= 25
º
C when mounted on FR4 PC board with recommended footprint (also see
figure 1.)
RF01101, Rev. A (1/10/13)
©2013 Microsemi Corporation
Page 1 of 5

 
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