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599-11-100-05-000428

产品描述IC Socket, BGA100, 100 Contact(s), ROHS COMPLIANT
产品类别连接器    插座   
文件大小88KB,共2页
制造商Mill-Max
官网地址https://www.mill-max.com
标准
下载文档 详细参数 全文预览

599-11-100-05-000428概述

IC Socket, BGA100, 100 Contact(s), ROHS COMPLIANT

599-11-100-05-000428规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Mill-Max
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性BGA ADAPTER
联系完成配合GOLD (10) OVER NICKEL (50)
联系完成终止Gold (Au) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER
设备插槽类型IC SOCKET
使用的设备类型BGA100
外壳材料FR4
JESD-609代码e4
触点数100

599-11-100-05-000428文档预览

Product Number: 599-11-100-05-000428
Description:
BGA Socket
1mm Grid; BGA Socket
Surface Mount
Accepts .008-.013" Leads
Plating Code:
11
Shell Plating:
10 " Gold over 100 " Nickel
Inner Contact Plating:
10 " Gold over 50 " Nickel
100-05-000
10 X 10
#
Of
Pins
100
Mill-Max
Part
Number
599-11-100-05-000428
RoHS
Compliant
CONTACT:
Contact Used: #04, Standard 3 Finger Contact
Current Rating =
2 Amps
BERYLLIUM COPPER ALLOY
172 (UNS C17200) per
ASTM B 194
Properties of BERYLLIUM COPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Hardness: 36-43 Rockwell C
Mechanical Life: 100 Cycles Min.
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Resistance: 10 miliohms Max
Operating Temperature: -55°C/+125°C
Melting point: 980°C/865°C (liquidus/solidus)
Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 ºC ; 70% of stress remains after 1,000 hours @ 200
ºC
*International Annealed Copper Standard, i.e. as a % of pure copper.
†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.
Mill-Max Mfg. Corp. Datasheet – Last Modified 6/27/2008
Page 1 of 2
LOOSE PIN:
Loose Pin Used: 9928
BRASS ALLOY
(UNS C36000) per ASTM B 16
Properties of BRASS ALLOY:
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%†
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
†(3 to 4% lead is used to permit “free machining” and is permitted by EC Directive 2002/95Annex 6; so all pin materials are
RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
INSULATOR INFORMATION:
FR-4
Laminate
High Temperature
Properties of FR-4 Laminate:
Epoxy/Glass Laminate. Thicknesses available: .010”, .020”, .031”, .047”, .062”, .093”, .125” (natural color, beige)
ENVIRONMENTAL DATA:
Operating temperature range: -55/+125 °C
Shock (No electrical discontinuity greater than 1 s):50 G
Solderability: 364-52
Resistance to soldering heat: 364-56A Test Cond. C
Resistance to atmospheric corrosion: 364-22A/31A
Climactic category (IEC): 365-17A - Nitric Acid Vapor Test: 365-17A
Vibration (No electrical discontinuity greater than 1 s): 10-2000 HZ, 15 G
Mill-Max Mfg. Corp. Datasheet – Last Modified 6/27/2008
Page 2 of 2
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