(Chip Common Mode Filter) Engineering Specification
HCM2012G Series
Features and Application
Powerful components with composite co-fired material to
solve
EMI
problem
for
high
speed differential
signal
transmission line as USB, and LVDS, without distortion to high
speed signal transmission
MIPI, MHL serial interface in mobile device.
PRODUCT DETAIL
Imp.Com.
(Ω)±25%
@100MHz
67
90
90
120
50
◆
◆
◆
◆
◆
DCR
Max.
(Ω)
1.0
1.0
1.0
1.2
1.0
Rated
Current
Max.(m A)
200
200
200
100
100
Rated
Voltage
(V)
10
10
10
10
10
Insulation
Resistance
Min.(MΩ)
100
100
100
100
100
Part Number
HCM2012GH670AE
HCM2012GH900AE
HCM2012GD900AE
HCM2012GD121AE
HCM2012GS500AE
Test Instruments
Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER
HP4338 MILLIOHMMETER
Agilent E5071C ENA SERIES NETWORK ANALYZER
HP6632B SYSTEM DC POWER SUPPLY
Keithley 2410 1100V SOURCE METER
PART NUMBER CODE
HCM
1
2012
2
G
□
90 0
3 4 5
□
E
8
6 7
1: Series name
2: Dimensions L*W
3: Material code
4: Product identification number
5: Impedance value
6: Fixed decimal point (ex : 900=90Ω)
7: UN internal code
8: Packaging style P
–
Embossed paper tape, 7”reel.
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
2014
1/7
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
HCM2012G Series
TYPICAL CHARACTERISTIC
HCM2012GH670A
Fig1.
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig2.
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
HCM2012GH900A
Fig3.
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig4.
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
2014
2/7
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
HCM2012G Series
HCM2012GD900A
Fig5.
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig6.
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
HCM2012GD121A
Fig7.
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig8.
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
2014
3/7
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
HCM2012G Series
Fig9.
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig10.
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
SHARES AND DIMENSIONS
TYPE
L
W
T
P
C1
C2
Dimension
1.25±0.10
1.00±0.10
0.50±0.10
0.50±0.10
0.30±0.10
0.20±0.15
Unit : mm
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
2014
4/7
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
HCM2012G Series
MEASURING CIRCUIT / CIRCUITS CONFIGURATION & LAYOUT PAD
TAPE AND REEL SPECIFICATIONS / TAPING DIMENSIONS
Type : Paper Carrier
Symbol
W
P1
E
F
Do
D1
Unit : mm
size
8.00±0.10
4.00±0.10
1.75±0.10
3.50±0.10
1.55±0.05
1.00±0.05
symbol
Po
P2
Bo
Ao
Ko
t
size
4.00±0.10
2.00±0.10
2.30±0.10
1.40±0.10
1.13±0.10
0.22±0.05
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
2014
5/7
Specifications are subject to change without notice.