INTERCONNECTS
2,0 Grid
Single and Double Row
•
2,0
2,0
Series 830, 831
832, 833
0,48
3,91
•
•
2,79
3,99
0,58
4,17
2,0
•
Fig. 1
4,0
2,0
2,0
Series 830 single and double row
interconnects have 2,0
spacing and permit board stacking
as low as 8,18 .
Pin headers (830 & 832) use
MM# 5012 pins. (See page 166
for details)
Sockets (831 & 833) use
MM# 1802 receptacle accepts pin
diameters from 0,38-0,64. (See page
138 for details)
Insulators are high temperature
thermoplastic, suitable for all
soldering operations.
Ordering Information
Single Row Pin Header
0,48
3,91
2,79
Fig. 1
3,99
4,17
830-XX-0_ _-10-001000
Specify # of pins
01-50
0,58
Double Row Pin Header
2,0
Fig. 2
832-XX-_ _ _-10-001000
Specify # of pins
002-100
Fig. 2
2,0
2,0
2,79
2,11
XX= Plating Code
See Below
SPECIFY PLATING CODE XX=
3,68
4,19
10
0,25µm Au
90
5,08µm Sn/Pb
40
5,08µm Sn
0,51
Pin Plating
3,18
Single Row Socket
2,0
Fig. 3
831-XX-0_ _-10-001000
Specify # of pins
01-50
Fig. 3
Double Row Socket
4,0
2,0
2,0
Fig. 4
833-XX-_ _ _-10-001000
Specify # of pins
002-100
2,79
2,11
3,68
4,19
0,51
3,18
XX= Plating Code
See Below
2,0
SPECIFY PLATING CODE XX=
13
0,76µm Au
91
10µ” Au
93
5,08µm Sn/Pb
0,76µm Au
99
Sn/Pb
41
43
44
Fig. 4
Sleeve (Pin)
Contact (Clip)
0,25µm Au
200µ”
Sn/Pb 200µ”Sn
5,08µm Sn
200µ”Sn
10µ” Au
0,76µm Au
200µ”Sn
w w w. m i l l - m a x . c o m
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