4000/14000/40000 SERIES, 5-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, UUC14, DIE-14
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIE |
| 包装说明 | DIE, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 其他特性 | SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS |
| 计数方向 | RIGHT |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-XUUC-N14 |
| 逻辑集成电路类型 | SERIAL IN SERIAL OUT |
| 位数 | 5 |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 传播延迟（tpd） | 400 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 最小 fmax | 14 MHz |
| CD4006BH | CD4006BF | CD4006BD | |
|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, 5-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, UUC14, DIE-14 | 4000/14000/40000 SERIES, 5-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14 | 4000/14000/40000 SERIES, 5-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIE | DIP | DIP |
| 包装说明 | DIE, | DIP, | HERMETIC SEALED, CERAMIC, DIP-14 |
| 针数 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown |
| 其他特性 | SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS | SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS | SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS |
| 计数方向 | RIGHT | RIGHT | RIGHT |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-XUUC-N14 | R-CDIP-T14 | R-CDIP-T14 |
| 逻辑集成电路类型 | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT |
| 位数 | 5 | 5 | 5 |
| 功能数量 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIE | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 400 ns | 400 ns | 400 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | UPPER | DUAL | DUAL |
| 最小 fmax | 14 MHz | 14 MHz | 14 MHz |
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