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MT9V136: 1/4-Inch Color CMOS NTSC/PAL Digital Image Sensor
Features
1/4-Inch Color CMOS NTSC/PAL Digital Image SOC
with Overlay Processor
MT9V136 Datasheet, Rev. J
For the latest datasheet, please visit
www.onsemi.com
Features
• Low-power CMOS image sensor with integrated
image flow processor (IFP) and video encoder
• 1/4-inch optical format, VGA resolution (640H x
480V)
• ±2.5% additional columns and rows to compensate
for lens alignment tolerances
• Overlay generator for dynamic bitmap overlay
• Integrated video encoder for NTSC/PAL with overlay
capability and 10-bit I-DAC
• Integrated microcontroller for flexibility
• On-chip image flow processor performs
sophisticated processing, such as color recovery and
correction, sharpening, gamma, lens shading
correction, on-the-fly defect correction, auto white
balancing, and auto exposure
• Auto black level calibration
• 10-bit, on-chip analog-to-digital converter (ADC)
• Internal master clock generated by on-chip phase-
locked loop (PLL)
• Two-wire serial programming interface
• Interface to low-cost Flash through SPI bus
• High-level host command interface
• Stand alone operation support
• Comprehensive tool support for overlay generation
and lens correction setup
• Development system with DevWare
• Overlay generation and compilation tools
Table 1:
Parameter
Pixel size
and type
Sensor format
NTSC output
PAL output
Imaging area
Optical format
Frame rate
Key Parameters
Typical Value
5.6
m
x 5.6
m
active pinned-
photodiode with high-sensitivity mode
for low-light conditions
680H x 512V (includes ±2.5% of rows
and columns for lens alignment)
720H x 480V
720H x 576V
Total array size: 3.584 mm x 2.688 mm
¼-inch
50/60 fields/sec
Progressive scan
RGB standard Bayer
Electronic rolling shutter (ERS)
Exposure, white balance, black level
offset correction, flicker avoidance,
color saturation control, on-the-fly
defect correction, aperture correction
Exposure, white balance, horizontal
and vertical blanking, color, sharpness,
gamma correction, lens shading
correction, horizontal and vertical
image flip, windowing, sampling rates,
GPIO control
Sensor scan mode
Color filter array
Shutter type
Automatic
Functions
Programmable
Controls
Key parameters are continued on next page.
Applications
• Analog surveillance CCTV
• Surveillance network IP camera
See details of new features on page 3.
See “Ordering Information” on page 4.
MT9V136 DS Rev. J Pub. 6/15 EN
1
©Semiconductor Components Industries, LLC 2015,
MT9V136: 1/4-Inch Color CMOS NTSC/PAL Digital Image Sensor
Applications
Table 2:
Parameter
Key Parameters (continued)
Typical Value
Utilizes SPI interface to load overlay data from external flash/EEPROM memory with the
following features:
•Overlay Size 360 x 480 pixel rendered into 720 x 480 pixel display format
•Up to four (4) overlays may be blended simultaneously
•Selectable readout: Rotating order user selected
•Dynamic scenes by loading pre-rendered frames from external memory
•Palette of 32 colors out of 64,000
•8 colors per bitmap
•Blend factor dynamically programmable for smooth transitions
•Fast Update rate of up to 30 fps
•Every bitmap object has independent x/y position
•Statistic Engine to calibrate optical alignment
•Number Generator
Programmable to any size
0.5–16x
10-bit, on-chip
Analog composite video out, single-ended or differential; 8-, 10-bit parallel digital
output
Digital: Raw Bayer 8-,10-bit, CCIR656, 565RGB, 555RGB, 444RGB
Parallel: 27 MB/s
NTSC: 60 fields/sec
PAL: 50 fields/sec
Two-wire I/F for register interface plus high-level command exchange. SPI port to
interface to external memory to load overlay data, register settings, or firmware
extensions.
27 MHz
4.5 - 9.0 - 18 MHz, programmable
Analog: 2.8 V ±5%
Core: 1.8 V ±5%
IO: 2.8V ±5%
Full resolution at 60 fps: <350mW
2
48-pin Ceramic LCC, 11.43mm x 11.43mm, 0.8mm pitch
Operating: –30°C to 70°C
Storage: –50°C to +150°C
< 200e/s at 60°C with a gain of 1
Column
Row
< 2%
< 2%
11.9 V/lux-s at 550nm
45 dB
74.6 dB
Notes:
1. Graphical overlay is available only in CCIR656 output format.
2. Analog output enabled; parallel output disabled.
Overlay Support
1
Windowing
Max analog gain
ADC
Output interface
Output data formats
1
Data rate
Control interface
Input clock for PLL
SPI Clock Frequencies
Supply voltage
Power consumption
Package
Ambient temperature
Dark Current
Fixed pattern noise
Responsivity
Signal to noise ratio (S/N)
Pixel dynamic range
MT9V136 DS Rev. J Pub. 6/15 EN
2
©Semiconductor Components Industries, LLC,2015.
MT9V136: 1/4-Inch Color CMOS NTSC/PAL Digital Image Sensor
New Features
New Features
Integrated Video Encoder for PAL/NTSC with Overlay Capability
• Composite analog output (NTSC/PAL)
• 8-bit parallel digital output ITU-R BT.656 format
• Raw Bayer format
On-Chip Overlay Generator
•
•
•
•
•
•
Static and dynamic overlay graphics with four overlay planes plus number plane
Support for serial SPI memory up to 16 megabytes
Number generator
Overlay blending and x/y positioning
Overlay position adjustment and statistics engine to calibrate overlay
Overlay support utilizes SPI interface to load overlay data from external
Serial Flash/EEPROM to support the following features:
– Overlay size 360 x 480 pixel rendered into 720 x 480 pixel display format
– Up to four overlays may be blended simultaneously
– Selectable readout: rotating order user selected
– Dynamic scenes by loading pre-rendered frames from external memory
– Palette of 32 colors out of 64,000
– Eight colors per bitmap
– Blend factor dynamically programmable for smooth transitions
– Fast update rate of up to 30 fps
– Every bitmap object has independent x/y position
– Statistics engine to calibrate optical alignment
MT9V136 DS Rev. J Pub. 6/15 EN
3
©Semiconductor Components Industries, LLC,2015.
MT9V136: 1/4-Inch Color CMOS NTSC/PAL Digital Image Sensor
Ordering Information
Ordering Information
Table 3:
Part Number
MT9V136C12STC-DR
MT9V136D00STCK22BC1-200
MT9V136W00STCK22BC1-750
Available Part Numbers
Product Description
Color VGA 1/4” SOC, CLCC Package
Color VGA 1/4” SOC
Color VGA 1/4”SOC
Orderable Product Attribute Description
Dry Pack without Protective Film
Die Sales, 200m Thickness
Wafer Sales, 750m Thickness
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full
description of the naming convention used for image sensors. For reference documenta-
tion, including information on evaluation kits, please visit our web site at
www.onsemi.com.
MT9V136 DS Rev. J Pub. 6/15 EN
4
©Semiconductor Components Industries, LLC,2015.
MT9V136: 1/4-Inch Color CMOS NTSC/PAL Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
New Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Pin Descriptions and Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
SOC Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Sensor Active Pixel Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Usage Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
External Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Slave Two-Wire Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Overlay Capability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Serial Memory Partition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Overlay Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Overlay Character Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Modes and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
MT9V136 DS Rev. J Pub. 6/15 EN
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©Semiconductor Components Industries, LLC,2015.
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