AHC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 20 |
Reach Compliance Code | unknown |
其他特性 | WITH DUAL OUTPUT ENABLE |
系列 | AHC |
JESD-30 代码 | R-GDFP-F20 |
长度 | 13.09 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 12 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.54 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 6.92 mm |
SN54AHC540W | 5962-9685001QRA | SN54AHC540FK | SN54AHC540FKR | SN74AHC540PWLE | SNJ54AHC540J | SN74AHC540DBLE | SN74AHC540DGV | SN54AHC540WR | |
---|---|---|---|---|---|---|---|---|---|
描述 | AHC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125 | AHC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, CC-20 | AHC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, CC-20 | Octal Buffers/Drivers With 3-State Outputs 20-TSSOP -40 to 85 | Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125 | Octal Buffers/Drivers With 3-State Outputs 20-SSOP -40 to 85 | AHC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, TVSOP-20 | AHC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 |
零件包装代码 | DFP | DIP | QFN | QFN | TSSOP | DIP | SSOP | SOIC | DFP |
包装说明 | DFP, | DIP, DIP20,.3 | QCCN, | QCCN, | TSSOP, TSSOP20,.25 | DIP, DIP20,.3 | SSOP, SSOP20,.3 | TSSOP, TSSOP20,.25,16 | DFP, |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant | unknown | unknown |
系列 | AHC | AHC/VHC/H/U/V | AHC | AHC | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC | AHC |
JESD-30 代码 | R-GDFP-F20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-PDSO-G20 | R-GDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-GDFP-F20 |
长度 | 13.09 mm | 24.195 mm | 8.89 mm | 8.89 mm | 6.5 mm | 24.195 mm | 7.2 mm | 5 mm | 13.09 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DFP | DIP | QCCN | QCCN | TSSOP | DIP | SSOP | TSSOP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | FLATPACK |
传播延迟(tpd) | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.54 mm | 5.08 mm | 2.03 mm | 2.03 mm | 1.2 mm | 5.08 mm | 2 mm | 1.2 mm | 2.54 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | NO | YES | YES | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
端子形式 | FLAT | THROUGH-HOLE | NO LEAD | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.4 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 6.92 mm | 7.62 mm | 8.89 mm | 8.89 mm | 4.4 mm | 7.62 mm | 5.3 mm | 4.4 mm | 6.92 mm |
厂商名称 | Texas Instruments(德州仪器) | - | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
其他特性 | WITH DUAL OUTPUT ENABLE | - | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF |
封装等效代码 | - | DIP20,.3 | - | - | TSSOP20,.25 | DIP20,.3 | SSOP20,.3 | TSSOP20,.25,16 | - |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - | - |
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