EE PLD, 15ns, CMOS, PDSO28, LEAD FREE, SOIC-28
参数名称 | 属性值 |
厂商名称 | Integrated Circuit Systems(IDT ) |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 28 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G28 |
长度 | 17.9 mm |
专用输入次数 | 12 |
I/O 线路数量 | 12 |
端子数量 | 28 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 12 DEDICATED INPUTS, 12 I/O |
输出函数 | MIXED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
可编程逻辑类型 | EE PLD |
传播延迟 | 15 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.64 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 7.5 mm |
PA7536SI-15L | PA7536JI-15L | PA7536P-15L | PA7536PI-15L | PA7536S-15L | PA7536J-15L | |
---|---|---|---|---|---|---|
描述 | EE PLD, 15ns, CMOS, PDSO28, LEAD FREE, SOIC-28 | EE PLD, 15ns, CMOS, PQCC28, LEAD FREE, PLASTIC, LCC-28 | EE PLD, 15ns, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 | EE PLD, 15ns, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 | EE PLD, 15ns, CMOS, PDSO28, LEAD FREE, SOIC-28 | EE PLD, 15ns, CMOS, PQCC28, LEAD FREE, PLASTIC, LCC-28 |
零件包装代码 | SOIC | QLCC | DIP | DIP | SOIC | QLCC |
包装说明 | SOP, | QCCJ, | DIP, | DIP, | SOP, | QCCJ, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G28 | S-PQCC-J28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | S-PQCC-J28 |
长度 | 17.9 mm | 11.5062 mm | 34.925 mm | 34.925 mm | 17.9 mm | 11.5062 mm |
专用输入次数 | 12 | 12 | 12 | 12 | 12 | 12 |
I/O 线路数量 | 12 | 12 | 12 | 12 | 12 | 12 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
组织 | 12 DEDICATED INPUTS, 12 I/O | 12 DEDICATED INPUTS, 12 I/O | 12 DEDICATED INPUTS, 12 I/O | 12 DEDICATED INPUTS, 12 I/O | 12 DEDICATED INPUTS, 12 I/O | 12 DEDICATED INPUTS, 12 I/O |
输出函数 | MIXED | MIXED | MIXED | MIXED | MIXED | MIXED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | QCCJ | DIP | DIP | SOP | QCCJ |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
最小供电电压 | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
宽度 | 7.5 mm | 11.5062 mm | 7.62 mm | 7.62 mm | 7.5 mm | 11.5062 mm |
厂商名称 | Integrated Circuit Systems(IDT ) | - | - | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) |
座面最大高度 | 2.64 mm | 4.369 mm | - | - | 2.64 mm | 4.369 mm |
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