PCI Bus Controller, CMOS, PBGA256, 27 MM, PLASTIC, BGA-256
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Tundra Semiconductor Corp |
| 包装说明 | 27 MM, PLASTIC, BGA-256 |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 32 |
| 总线兼容性 | MC68360; MPC860 |
| 最大时钟频率 | 50 MHz |
| 驱动器接口标准 | IEEE 1149.1 |
| 外部数据总线宽度 | 32 |
| JESD-30 代码 | S-PBGA-B256 |
| JESD-609代码 | e0 |
| 长度 | 27 mm |
| 湿度敏感等级 | 3 |
| 端子数量 | 256 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.5 mm |
| 最大供电电压 | 3.46 V |
| 最小供电电压 | 3.14 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 27 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI |
| CA91L862A-50IE | CA91L862A-50CE | CA91L862A-40CL | CA91L862A-50IL | CA91L862A-50CL | CA91L862A-40CE | |
|---|---|---|---|---|---|---|
| 描述 | PCI Bus Controller, CMOS, PBGA256, 27 MM, PLASTIC, BGA-256 | PCI Bus Controller, CMOS, PBGA256, 27 MM, PLASTIC, BGA-256 | PCI Bus Controller, CMOS, PBGA256, 17 MM, PLASTIC, BGA-256 | PCI Bus Controller, CMOS, PBGA256, 17 MM, PLASTIC, BGA-256 | PCI Bus Controller, CMOS, PBGA256, 17 MM, PLASTIC, BGA-256 | PCI Bus Controller, CMOS, PBGA256, 27 MM, PLASTIC, BGA-256 |
| 厂商名称 | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp |
| 包装说明 | 27 MM, PLASTIC, BGA-256 | 27 MM, PLASTIC, BGA-256 | 17 MM, PLASTIC, BGA-256 | 17 MM, PLASTIC, BGA-256 | 17 MM, PLASTIC, BGA-256 | 27 MM, PLASTIC, BGA-256 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 总线兼容性 | MC68360; MPC860 | MC68360; MPC860 | MC68360; MPC860 | MC68360; MPC860 | MC68360; MPC860 | MC68360; MPC860 |
| 最大时钟频率 | 50 MHz | 50 MHz | 40 MHz | 50 MHz | 50 MHz | 40 MHz |
| 驱动器接口标准 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 | IEEE 1149.1 |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
| 长度 | 27 mm | 27 mm | 17 mm | 17 mm | 17 mm | 27 mm |
| 端子数量 | 256 | 256 | 256 | 256 | 256 | 256 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.5 mm | 3.5 mm | 1.8 mm | 1.8 mm | 1.8 mm | 3.5 mm |
| 最大供电电压 | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V |
| 最小供电电压 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1 mm | 1 mm | 1 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 27 mm | 27 mm | 17 mm | 17 mm | 17 mm | 27 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI |
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