EEPROM, 512X8, Serial, CMOS, PDIP8, MINI, PLASTIC, DIP-8
| 参数名称 | 属性值 |
| 厂商名称 | Xicor Inc |
| 包装说明 | MINI, PLASTIC, DIP-8 |
| Reach Compliance Code | unknown |
| 其他特性 | 2 WIRE INTERFACE;PAGE WRITE |
| 最大时钟频率 (fCLK) | 0.1 MHz |
| JESD-30 代码 | R-PDIP-T8 |
| 长度 | 10.03 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.32 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| X24042PMB-3 | X24042S8MB-2.7 | X24042S8MB-3 | X24042S8MB | X24042PMB | X24042PMB-2.7 | |
|---|---|---|---|---|---|---|
| 描述 | EEPROM, 512X8, Serial, CMOS, PDIP8, MINI, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, MINI, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, MINI, PLASTIC, DIP-8 |
| 包装说明 | MINI, PLASTIC, DIP-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | MINI, PLASTIC, DIP-8 | MINI, PLASTIC, DIP-8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 其他特性 | 2 WIRE INTERFACE;PAGE WRITE | 2 WIRE INTERFACE;PAGE WRITE | 2 WIRE INTERFACE;PAGE WRITE | 2 WIRE INTERFACE;PAGE WRITE | 2 WIRE INTERFACE;PAGE WRITE | 2 WIRE INTERFACE;PAGE WRITE |
| 最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 |
| 长度 | 10.03 mm | 4.9 mm | 4.9 mm | 4.9 mm | 10.03 mm | 10.03 mm |
| 内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.32 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.32 mm | 4.32 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 2.7 V | 3 V | 4.5 V | 4.5 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 厂商名称 | Xicor Inc | - | - | Xicor Inc | Xicor Inc | Xicor Inc |
ADI参考电路
嵌入式系统
Microchip MCU
电子竞赛
测评中心专版
微控制器 MCU
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