8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | WDIP, DIP28,.6 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 250 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-CDIP-T28 |
| 长度 | 36.83 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 21 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.907 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | NMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| TMS2764-25JL | TMS2764-20JL | TMS27P64-25NL | TMS27P64-30NL | TMS2764-17JL | TMS2764-45JL | TMS2764-35JL | TMS27P64-45NL | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 OTPROM, 250ns, PDIP28 | 8KX8 OTPROM, 300ns, PDIP28 | 8KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 UVPROM, 450ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | IC,EPROM,8KX8,MOS,DIP,28PIN,CERAMIC | 8KX8 OTPROM, 450ns, PDIP28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| 最长访问时间 | 250 ns | 200 ns | 250 ns | 300 ns | 170 ns | 450 ns | 350 ns | 450 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-CDIP-T28 | R-CDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-XDIP-T28 | R-PDIP-T28 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | WDIP | WDIP | DIP | DIP | WDIP | WDIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 21 V | 21 V | 21 V | 21 V | 21 V | 21 V | 21 V | 21 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | MOS | NMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 长度 | 36.83 mm | 36.83 mm | 36.32 mm | 36.32 mm | 36.83 mm | 36.83 mm | - | 36.32 mm |
| 内存集成电路类型 | UVPROM | UVPROM | OTP ROM | OTP ROM | UVPROM | UVPROM | - | OTP ROM |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 座面最大高度 | 4.907 mm | 4.907 mm | 5.08 mm | 5.08 mm | 4.907 mm | 4.907 mm | - | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | - | 4.75 V |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | - | 15.24 mm |
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