HPW Series
Mixed Signal & Power
Connectors
Product description
Mixed power & signal PCB connector
Approvals
Qualified at a system level on both civil and military
programs
Features
•
Rugged design
•
Signal & power contacts
•
High reliability contacts
Markets
Mil/Aero Space, Marine, Rail & Industrial
HPW PART NUMBER CONFIGURATOR
PERFORMANCE/SPECIFICATION
MATERIAL
Insulator
Contact pin & socket
Socket wires
Polyphenylene sulphide
Copper alloy
Beryllium copper
CURRENT RATING
INSULATION
MECHANICAL ENDURANCE
ENGAGEMENT/WITHDRAWAL FORCES
TEMPERATURE RANGE
Guides
Contact Plating
Contact Resistance
Stainless steel
MIL-G-45204 gold plate
Size 22:
Size 16:
11.0 milliohms maximum
4.5 milliohms maximum
VOLTAGE RATING
Size 22:
Size 16:
5 Amp
15 Amp
5 Gigohms minimum at 500Vdc
In excess of 2000 operations
0.42 N (1.5 oz) nominal per contact
-55°C to +125°C
400 V dc or ac peak nominal (@sealevel)
Size 22:
Size 16:
0.75 mm nominal
1.56 mm nominal
MALE PIN DIAMETER
JUNE
2007
1
HPW Series
ORDERING INFORMATION
H P W
0 6 3
S
M
M
C A
0 P 0
PREFIX
No. of CAVITIES
63, 92, 100, 107
CONTACT PLATING
U = See below
S = U Plating with tin dipped termination
CONTACT GENDER
M = Male
F = Female
CONTACT TERMINATION
0 = No contacts
C = Crimp bucket
X = Through board solder - 180°
B = Through board solder - 90°
M = Mixed
Note: not all combinations are available
STANDARD VARIATIONS
000 = Standard
0P0 = Back potting
Non Readable Code = Contact mix configuraion etc.
POLARISING/GUIDES
CA = Male jacking, polarised, free rotating
TA = Female jacking, polarised, vertical mount
NB = Male polarised, vertical mount
FE = Female polarised, vertical mount
FB = Female polarised, float mount
NC = Male polarised, transverse mount
FF = Female polarised, transverse mount
CONTACT PLATING FINISHES
Connector Finish
Ordering Code
Description
Component
Component Finish
Ordering Code
Conforms to
Plating
Thickness*
Socket
U
Gold Plate
-/9
MIL-G-45204
(Type II, Grade C,
Class 1)
MIL-G-45204
(Type II, Grade C,
Class 1)
1.27 µm gold plate
50 µin gold plate
minimum
1.27 µm gold plate
50 µin gold plate
minimum
Pin
-/7
*PLATING THICKNESS
These values apply to mating surfaces.
Dimensions are in mm
2
JUNE
2007
HPW Series
HPW STANDARD PCB TERMINATIONS
MALE HALF
TERMINATION B: Through Board Solder 90°
Size 16
63 Way & 100 Way
92 Way & 107 Way
Size 22
63 Way
92 Way & 107 Way
100 Way
TERMINATION X: Through Board Solder 180°
Size 16
63 Way & 100 Way
92 Way & 107 Way
Size 22
63 Way
92 Way & 107 Way
100 Way
3.80
2.80
3.80
2.80
Dimensions are in mm
JUNE
2007
5
FPGA/CPLD
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