MBS2 - MBS10
0.8A Single Phase Glass Pass. Bridge Rectifier
Voltage range 200-1000 Volts
Features
Ideal for use with printed circuit boards
Reliable low cost construction utilizing
molded plastic techniques
High surge-current capability
High-temperature soldering guaranteed:
250°C / 10 seconds at 5 lbs., (2.3 kg )
tension
Small size, simple installation
Leads solderable per MIL-STD-202
Method 208
MBS
.193(4.90)
.177(4.50)
.033(0.84)
.022(0.56)
.157(4.00)
.142(3.60)
.276(7.0)
MAX
.102(2.60)
.087(2.20)
.106(2.70)
.090(2.30)
.053(1.53)
.0.37(0.95)
.014(0.35)
.006(0.15)
.008(0.20)
MAX
.118(3.0)
MAX
.083(2.12)
.043(1.10)
.043(1.10)
.028(0.70)
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Parameter
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated Load
(JEDEC method )
Maximum Instantaneous Forward Voltage
@ 0.4A
Maximum DC Reverse Current @ T
A
=25°C
at Rated DC Blocking Voltage @ T
A
=125°C
Typical Junction Capacitance Per Leg
Typical Thermal Resistance Per Leg Rth
JA
Operating Temperature Range T
J
Storage Temperature Range T
STG
MBS2
200
140
200
MBS4
400
280
400
MBS6
600
420
600
0.5
0.8
35
1.0
5.0
100
13
85
-55 to +150
-55 to +150
MBS8
800
560
800
MBS10
Units
1000
V
700
V
1000
V
A
A
V
uA
uA
pF
°C/W
°C
°C
8/26/2004 Rev.1.01
www.SiliconStandard.com
1 of 2
MBS2 - MBS10
RATINGS AND CHARACTERISTIC CURVES (MBS2 through MBS10)
FIG.1- DERATING CURVE FOR OUTPUT RECTIFIED
CURRENT
0.8
FIG.2-MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT PER LEG
35
AVERAGE FORWARD RECTIFIED CURRENT. (A)
0.7
0.6
PEAK FORWARD SURGE CURRENT. (A)
Aluminum Substrate
30
Ta=40 C
Single Half Sine-Wave
(JEDEC Method)
25
0.5
0.4
0.3
0.2
0.1
0
0
20
40
60
80
100
120
O
Glass
Epoxy
P C.B
.
20
F=50 Hz
F=60 Hz
15
10
Resistive or Inductive Load
5.0
1 Cycle
0
140
160
1
10
Number of Cycles)
100
AMBIENT TEMPERATURE. ( C)
FIG.3- TYPICAL FORWARD VOLTAGE
CHARACTERISTICS PER LEG
INSTANTANEOUS REVERSE LEAKAGE CURRENT. (µA)
10
FIG.4- TYPICAL REVERSE LEAKAGE
CHARACTERISTICS PER LEG
100
INSTANTANEOUS FORWARD CURRENT. (A)
Tj=150
0
C
1
Tj=25
0
C
10
Tj=125
0
C
1
0.1
0.1
Tj=25 C
Pulse Width=300µs
1% Duty Cycle
0.01
0.2
Tj=25
0
C
0.01
0
80
20
40
60
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
100
0.4
0.6
0.8
1.0
1.2
INSTANTANEOUS FORWARD VOLTAGE. (V)
1.4
FIG.5- TYPICAL JUNCTION CAPACTITANCE
PER LEG
30
JUNCTION CAPACITANCE (pF)
25
Tj=25 C
f = 1 MHz
Vsig = 50mVp-p
20
15
10
5.0
0
0.1
1
10
REVERSE VOLTAGE. (V)
100 200
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
8/26/2004 Rev.1.01
www.SiliconStandard.com
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