128KX16 STANDARD SRAM, 55ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48
参数名称 | 属性值 |
厂商名称 | Rochester Electronics |
零件包装代码 | BGA |
包装说明 | 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 |
针数 | 48 |
Reach Compliance Code | unknown |
最长访问时间 | 55 ns |
JESD-30 代码 | S-PBGA-B48 |
长度 | 7 mm |
内存密度 | 2097152 bit |
内存集成电路类型 | STANDARD SRAM |
功能数量 | 1 |
端子数量 | 48 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 128KX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
认证状态 | COMMERCIAL |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.3 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 0.75 mm |
端子位置 | BOTTOM |
宽度 | 7 mm |
CY62137CV30LL-55BAI | CY62137CV33LL-70BAIT | CY62137CV30LL-55BVIT | CY62137CV30LL-70BAIT | CY62137CV30LL-70BVXI | CY62137CVSL-70BAIT | CY62137CV33LL-70BAI | |
---|---|---|---|---|---|---|---|
描述 | 128KX16 STANDARD SRAM, 55ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | 128KX16 STANDARD SRAM, 70ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | 128KX16 STANDARD SRAM, 55ns, PBGA48, 6 X 8 MM, 1 MM HEIGHT, FBGA-48 | 128KX16 STANDARD SRAM, 70ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | 128KX16 STANDARD SRAM, 70ns, PBGA48, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, FBGA-48 | 128KX16 STANDARD SRAM, 70ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | 128KX16 STANDARD SRAM, 70ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | TFBGA, | 6 X 8 MM, 1 MM HEIGHT, FBGA-48 | 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, FBGA-48 | 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48 | TFBGA, |
针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 55 ns | 70 ns | 55 ns | 70 ns | 70 ns | 70 ns | 70 ns |
JESD-30 代码 | S-PBGA-B48 | S-PBGA-B48 | R-PBGA-B48 | S-PBGA-B48 | R-PBGA-B48 | S-PBGA-B48 | S-PBGA-B48 |
长度 | 7 mm | 7 mm | 8 mm | 7 mm | 8 mm | 7 mm | 7 mm |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TFBGA | TFBGA | VFBGA | TFBGA | VFBGA | TFBGA | TFBGA |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 1.2 mm | 1.2 mm | 1 mm | 1.2 mm | 1 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.3 V | 3.6 V | 3.3 V | 3.3 V | 3.3 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 3 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 3 V |
标称供电电压 (Vsup) | 3 V | 3.3 V | 3 V | 3 V | 3 V | 3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 7 mm | 7 mm | 6 mm | 7 mm | 6 mm | 7 mm | 7 mm |
JESD-609代码 | - | - | e0 | e0 | e1 | e0 | - |
端子面层 | - | - | TIN LEAD | TIN LEAD | TIN SILVER COPPER | TIN LEAD | - |
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