ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, PQCC28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Dynex |
| 包装说明 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | 3 V |
| 最长转换时间 | 0.04 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 25 MHz |
| 最大压摆率 | 165 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| VP1058FCGHPAS | VP1058FCGDGAS | VP1058FCGDPAS | |
|---|---|---|---|
| 描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, PQCC28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, CDIP28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, PDIP28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC28,.5SQ | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5 V | 5 V | 5 V |
| 最小模拟输入电压 | 3 V | 3 V | 3 V |
| 最长转换时间 | 0.04 µs | 0.04 µs | 0.04 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | S-PQCC-J28 | R-GDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 输出位码 | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT | BINARY, COMPLEMENTARY BINARY, OFFSET 2'S COMPLEMENT, COMPLEMENTARY OFFSET 2'S COMPLEMENT | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP |
| 封装等效代码 | LDCC28,.5SQ | DIP28,.6 | DIP28,.6 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 25 MHz | 25 MHz | 25 MHz |
| 最大压摆率 | 165 mA | 165 mA | 165 mA |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL |
| 厂商名称 | Dynex | - | Dynex |
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