电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

IDT54FCT162374CTE

产品描述Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48
产品类别逻辑    逻辑   
文件大小123KB,共8页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT54FCT162374CTE概述

Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48

IDT54FCT162374CTE规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
零件包装代码DFP
包装说明0.025 INCH PITCH, CERPACK-48
针数48
Reach Compliance Codeunknown
其他特性MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C
系列FCT
JESD-30 代码R-GDFP-F48
JESD-609代码e0
长度15.748 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
位数8
功能数量2
端口数量2
端子数量48
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE WITH SERIES RESISTOR
输出极性TRUE
封装主体材料CERAMIC, GLASS-SEALED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
传播延迟(tpd)6.2 ns
认证状态Not Qualified
座面最大高度2.1844 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式FLAT
端子节距0.635 mm
端子位置DUAL
宽度9.652 mm

IDT54FCT162374CTE相似产品对比

IDT54FCT162374CTE IDT54FCT16374ATEB IDT54FCT16374ATE IDT54FCT16374CTE IDT54FCT162374ATE IDT54FCT162374ATEB IDT54FCT16374ETE IDT54FCT16374TE IDT54FCT162374TE IDT54FCT162374TEB
描述 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, GREEN, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, GREEN, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, GREEN, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48
零件包装代码 DFP DFP DFP DFP DFP DFP DFP DFP DFP DFP
包装说明 0.025 INCH PITCH, CERPACK-48 DFP, FL48,.4,25 DFP, DFP, 0.025 INCH PITCH, CERPACK-48 CERPACK-48 CERPACK-48 DFP, 0.025 INCH PITCH, CERPACK-48 CERPACK-48
针数 48 48 48 48 48 48 48 48 48 48
Reach Compliance Code unknown not_compliant unknown unknown unknown not_compliant compliant unknown unknown not_compliant
其他特性 MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C POWER OFF DISABLE O/PS; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS POWER OFF DISABLE O/PS; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS POWER OFF DISABLE O/PS; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C MAX OUTPUT SKEW = 0.5NS; TYP VOLP < 0.6V @ VCC = 5V, TA = 25 DEGREE C POWER OFF DISABLE O/PS; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS POWER OFF DISABLE O/P\'S; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS MAX OUTPUT SKEW = 500PS; TYP VOLP < 0.6V AT VCC = 5V,TA = 25 DEGREE C MAX OUTPUT SKEW = 0.5NS; TYP VOLP < 0.6V @ VCC = 5V, TA = 25 DEGREE C
系列 FCT FCT FCT FCT FCT FCT FCT FCT FCT FCT
JESD-30 代码 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 15.748 mm 15.875 mm 15.875 mm 15.875 mm 15.748 mm 15.875 mm 15.875 mm 15.875 mm 15.748 mm 15.875 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 8 8 8 8 8 8 8 8 8 8
功能数量 2 2 2 2 2 2 2 2 2 2
端口数量 2 2 2 2 2 2 2 2 2 2
端子数量 48 48 48 48 48 48 48 48 48 48
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE 3-STATE 3-STATE 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE 3-STATE 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DFP DFP DFP DFP DFP DFP DFP DFP DFP DFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
传播延迟(tpd) 6.2 ns 7.2 ns 7.2 ns 6.2 ns 7.2 ns 7.2 ns 7.2 ns 11 ns 11 ns 11 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.1844 mm 2.413 mm 2.413 mm 2.413 mm 2.1844 mm 2.413 mm 2.413 mm 2.413 mm 2.1844 mm 2.413 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD Tin/Lead (Sn/Pb)
端子形式 FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT
端子节距 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm
厂商名称 IDT (Integrated Device Technology) - - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF - 50 pF 50 pF 50 pF
Base Number Matches - 1 1 1 1 1 1 - - -
怎么样编写这个控制流程?
我用的是32位RISC 嵌入式SoC 芯片,主频20M,内存2M,FLASH2M,现在要编写一个车辆进出的控制程序,其中该控制设备外接了很多外设,比如说打印机等,因为以前没做过类似的程序,现在想请教各为大侠总的思路应该是怎么样的?如何来处理来自不同设备的信号,大概的一个框架应该如何搭建?有一点要说明的是这个嵌入式平台不跑任何操作系统,以前只做过带LINUX操作系统的设计,现在没有任何操作系统,都不...
chengchen3 嵌入式系统
关于模拟电路工程师的交流与成长
王玮先生已经在模拟应用领域有了相当深厚的基础,请问对模拟电路工程师之间的互相交流是否有所心得。 这里先分清两个概念,我看到楼下的帖子提问的都是偏向于analog ic而不是analog application的。现在无论在学校还是企业,真正专门从事analog application的人都不多,往往每个地方就那么一二个人,所以模拟电路工程师之间缺乏有效的交流,并且模拟多为时间和经验的积累,不少东西...
fighting 模拟电子
am335x adc touch
am335x adc touch 这部分.我在文档(Technical Reference Manual)上的STEPCONFIG1寄存器里.看到了WPNSW、XNPSW、等这些东西。请问这些东西是代表什么意思。哪个文档上有说明。...
chenli DSP 与 ARM 处理器
单工无线呼叫系统
[i=s] 本帖最后由 paulhyde 于 2014-9-15 03:28 编辑 [/i]电设D题论文:单工无线呼叫系统...
Anderution 电子竞赛
【上海】高科技创业公司招FAE,电源管理/LED驱动方向_2014/08/29
[font=Verdana, Helvetica, Arial, sans-serif][size=12px][table=98%][tr][td][p=30, 2, left][font=]公司是一家创业公司[/font][color=#333333],由国内知名上市公司和国家科学产业基金共同投资,核心成员都是高学历,有十多年数模混合[/color]集成电路设计[color=#333333]的[...
fullbridge 求职招聘
分享TMS320F2812 DSP编程之AD采样精度的校准算法
F2812内部集成了ADC转换模块。该模块是一个12位、具有流水线结构的模数转换器,内置双采样保持器(S/H),可多路选择16通道输入,快速转换时间运行在25 MHz、ADC时钟或12.5 Msps,16个转换结果寄存器可工作于连续自动排序模式或启动/停止模式。在实际使用中,ADC的转换结果误差较大,如果直接将此转换结果用于控制回路,必然会降低控制精度。(最大转换误差可以达到9%左右)F2812的...
Jacktang 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 149  298  669  873  1184 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved