电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDWM-42-01-L-S-120

产品描述Board Stacking Connector, 42 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,
产品类别连接器    连接器   
文件大小86KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

HDWM-42-01-L-S-120概述

Board Stacking Connector, 42 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,

HDWM-42-01-L-S-120规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Reach Compliance Codecompli
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD (10)
联系完成终止MATTE TIN
触点性别MALE
触点材料PHOSPHOR BRONZE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
制造商序列号HDWM
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数1
选件GENERAL PURPOSE
端子节距1.27 mm
端接类型SOLDER
触点总数42
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
REVISION
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
ASSEMBLY OPERATION
2. MAXIMUM ALLOWABLE BOW: .005 [0.13]IN/IN.
3. MAXIMUM PIN VARIATIONS BETWEEN ANY
TWO PINS: .010 [0.25].
FILL T-1M6-XX-XX-2
4. MINIMUM TERMINAL PUSHOUT FORCE: 2 LBS.
FILL HTMS-50-X
5. MAXIMUM PIN ROTATION IN BODY: 2°.
6. MAXIMUM CUT FLASH .010 [0.25].
7. TUBE POSITIONS -07 THRU -50. POSITIONS -01
THRU -06 ARE TO BE LAYER PACKAGED.
8. FOR -D, USE DWM-50-D WHEN RAN ON BOARD
STACKER AUTOMATION, HTMS-50-D FOR ALL
OTHER PROCESSES. FOR -S, USE HTMS-50-S.
9. FOR -L, -S & -G PLATING, GOLD WILL BE ON CONTACT AREA.
CRITICAL DIMENSION INSPECTION INSTRUCTION
TABLE
IN-PROCESS INSPECTION
HDWM-XX-XX-XX-X-XXX-XXX
NO OF POS
(-01 THRU -50)
OPTION
POLARIZING SPECIFICATION
XXX INDICATES POS. TO BE OMITTED
(SEE FIG 1 AND 2)
BOARD SPACE
-XXX: BOARD SPACE
MAX = "L" - .120[3.05]
BODY SPECIFICATION
-S: SINGLE (USE HTMS-50-S)
-D: DOUBLE (USE HTMS-50-D)
C1, C3
C2
02
LEAD STYLE
SEE TABLE 1
PLATING SPECIFICATION
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
3µ" SELECTIVE GOLD ON TAIL.
-T: MATTE TIN ON ENTIRE PIN.
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-TM: MATTE TIN ON ENTIRE PIN.
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
01 03
C
NO OF POS X .050[1.27]
.018 0.46 REF
C1-B-DC
[
+.002[0.05]
-.010[0.25]
]
CONTACT
AREA
2 MAX SWAY
(EITHER DIRECTION)
.100 2.54 REF
03 02 01
.096 2.44 REF
.196 4.98 REF
.000 0.00 MIN
(SEE NOTE 3)
(SEE NOTE 8)
-XXX±.008[0.20]
BOARD SPACE OPTION
(.200[5.08] MIN)
(MAX = "L" - .120[3.05])
C
C2-B-DC
"L"
REF
.100 2.54
REF (TYP)
C3-B,I-DC
C
.120±.008 3.05±0.20
.050 1.27
(TYP)
2 MAX SWAY
(EITHER DIRECTION)
HTMS-50-D
.020 0.51 REF
(DOUBLE BODY SPECIFICATION)
FIG 1
(SEE NOTE 5)
T-IM6-XX-XX-2
HTMS-50-S
(SINGLE BODY SPECIFICATION)
(DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1)
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
FIG 2
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
INSULATOR:
LCP, UL 94 VO, COLOR: BLACK
TERMINAL: PHOS BRONZE
SHEET SCALE: 12:1
HI TEMP BOARD SPACING MICRO STRIPS
HDWM-XX-XX-XX-X-XXX-XXX
F:\dwg\sw\exisprod\Assembly\050\HDWM-XX-XX-XX-X-XXX-XXX-ASM.SLDDRW
BY:
G REIDINGER 08/03/1992
SHEET
1
OF
1
Samsung 2440 display + mouse bug.
在 2440 WinCE 5.0 下, 接上 mouse 時, 若按下 left button 一直不放並向右下拉時, 螢幕上會出現一個虛線邊的方框, 此時 button 不要放再繼續往左上拉回時, 螢幕會出現 cursor 移動的軌跡. ......
yiyi4567 嵌入式系统
应soso姐建议献丑下下
呼呼·~还比较符合力学远离吧? 第一次用漆包线和焊锡丝做造型,丑了点,大家见笑咯~ 能看得出来是什么么...
angelinzy 聊聊、笑笑、闹闹
求命啊大侠们,关于2812的CMD文件
这个是CMD文件中的一段 .const: load= FLASHBPAGE0,run=RAML0L1PAGE1 { /*GetRunAddress */ __const_run=.; /*MarkLoadAddress*/ *(.c_mark) /*Allocate.const */ *(.const) /*ComputeLength ......
e7ending 微控制器 MCU
关于DD2控制器IP 核调用问题
各位老大,我今天直接调了个DDR2控制器IP核作为顶层,综合能过,加上DQ和DQS管脚约束,fitter时就报 Error: The I/O standard LVDS cannot be used on the Bidir pin mem_clk.双向信号不能用差 ......
eeleader FPGA/CPLD
PIC16单片机的C编译起哪儿下载?如何与MAPLAB一起使用?
找了很长时间,网上都没有PIC16单片机得C编译器(很多都是DEMO)。还有,如果有了这个单片机,如何在MAPLAB中使用这个编译器?...
yingzi9 Microchip MCU
硬件
请问,现在学网络硬件,因为学校没有足够的硬件让我们去实践,都是在虚拟机上完成的,这样出去的学生会有人要吗?...
smset 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1593  289  560  1584  1053  33  6  12  32  22 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved