DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE
(unless otherwise specified)
Limits
Symbol
V
IH
V
IL
V
T+
−V
T−
V
IK
V
OH
Parameter
Input HIGH Voltage
Input LOW Voltage
Hysteresis
Input Clamp Diode Voltage
Output HIGH Voltage
2.4
2.0
0.25
0.35
0.4
0.5
20
−200
A or B, DR or
E
I
IH
Input HIGH Current
DR or E
A or B
I
IL
I
OS
Input LOW Current
Output Short Circuit Current (Note 2)
Power Supply Current
Total, Output HIGH
I
CC
Total, Output LOW
−40
20
0.1
0.1
−0.2
−225
70
90
mA
V
CC
= MAX
0.2
0.4
−0.65
3.4
−1.5
Min
2.0
0.8
Typ
Max
Unit
V
V
V
V
V
V
V
V
μA
μA
μA
mA
mA
mA
mA
Test Conditions
Guaranteed Input HIGH Voltage for
All Inputs
Guaranteed Input LOW Voltage for
All Inputs
V
CC
= MIN
V
CC
= MIN, I
IN
=
−
18 mA
V
CC
= MIN, I
OH
=
−
3.0 mA
V
CC
= MIN, I
OH
= MAX
I
OL
= 12 mA
I
OL
= 24 mA
V
CC
= V
CC
MIN,
V
IN
= V
IL
or V
IH
per Truth Table
V
OL
I
OZH
I
OZL
Output LOW Voltage
Output Off Current HIGH
Output Off Current LOW
V
CC
= MAX, V
OUT
= 2.7 V
V
CC
= MAX, V
OUT
= 0.4 V
V
CC
= MAX, V
IN
= 2.7 V
V
CC
= MAX, V
IN
= 7.0 V
V
CC
= MAX, V
IN
= 5.5 V
V
CC
= MAX, V
IN
= 0.4 V
V
CC
= MAX
Total at HIGH Z
95
2. Not more than one output should be shorted at a time, nor for more than 1 second.
AC CHARACTERISTICS
(T
A
= 25°C, V
CC
= 5.0 V, T
RISE
/ T
FALL
≤
6.0 ns)
Limits
Symbol
t
PLH
t
PHL
t
PZH
t
PZL
t
PLZ
t
PHZ
Parameter
Propagation Delay, Data to Output
Output Enable Time to HIGH Level
Output Enable Time to LOW Level
Output Disable Time from LOW Level
Output Disable Time from HIGH Level
Min
Typ
8.0
8.0
25
27
15
15
Max
12
12
40
40
25
25
Unit
ns
ns
ns
ns
ns
C
L
= 5.0 pF,
R
L
= 667
Ω
C
L
= 45 pF,
R
L
= 667
Ω
Test Conditions
http://onsemi.com
2
SN74LS245
PACKAGE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 738−03
ISSUE E
−A−
20
1
11
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0
_
15
_
0.51
1.01
B
10
C
L
−T−
SEATING
PLANE
K
E
G
F
D
20 PL
N
J
0.25 (0.010)
M
20 PL
M
0.25 (0.010)
T A
M
M
T B
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D−05
ISSUE F
D
A
11
X 45
_
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0
_
7
_
H
M
B
M
20
10X
0.25
E
1
10
20X
B
0.25
M
B
T A
S
B
S
A
e
SEATING
PLANE
h
18X
A1
T
C
http://onsemi.com
3
L
SN74LS245
PACKAGE DIMENSIONS
M SUFFIX
SOEIAJ PACKAGE
CASE 967−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A
1
b
c
D
E
e
H
E
L
L
E
M
Q
1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
−−−
0.032
20
11
L
E
Q
1
M
_
L
DETAIL P
E H
E
1
10
Z
D
e
A
VIEW P
c
b
0.13 (0.005)
M
A
1
0.10 (0.004)
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
白光LED光衰原因之荧光粉性能的衰退 到目前，白光 LED、尤其是小功率白光 LED 的发光性能快速衰退已越来越为人们所认识。其实，盲目地夸大宣传，只能将 LED 行业引向歧途，不正视白光 LED 存在的问题，只能延缓白光 LED 应用的发展。只有正视问题、研究问题、尽早解决问题，白光 LED 才能健康、快速发展。 白光 LED 当前面临的一个主要问题就寿命问题。由于白光 LED 的价格尚很...[详细]
工业自动化与控制
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
