IC OP-AMP, 1000 uV OFFSET-MAX, CDFP10, CERPACK-10, Operational Amplifier
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | DFP |
包装说明 | QFF, |
针数 | 10 |
Reach Compliance Code | compliant |
ECCN代码 | USML XV(E) |
放大器类型 | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.004 µA |
标称共模抑制比 | 70 dB |
最大输入失调电压 | 1000 µV |
JESD-30 代码 | R-GDFP-F10 |
JESD-609代码 | e0 |
负供电电压上限 | -20 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 10 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | QFF |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 2.29 mm |
供电电压上限 | 20 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.35 mm |
RH108AMW | RH108AMW#PBF | RH108AMJ8#PBF | RH108AMH#PBF | RH108AMJ8 | RH108AMH | |
---|---|---|---|---|---|---|
描述 | IC OP-AMP, 1000 uV OFFSET-MAX, CDFP10, CERPACK-10, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, CDFP10, CERPACK-10, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, CDIP8, CERDIP-8, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, CDIP8, CERDIP-8, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier |
是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | DFP | DFP | DIP | TO-5 | DIP | TO-5 |
包装说明 | QFF, | QFF, | DIP, | TO-5, | DIP, | TO-5, |
针数 | 10 | 10 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | USML XV(E) | USML XV(E) | USML XV(E) | USML XV(E) | USML XV(E) | USML XV(E) |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.004 µA | 0.004 µA | 0.004 µA | 0.004 µA | 0.004 µA | 0.004 µA |
标称共模抑制比 | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB |
最大输入失调电压 | 1000 µV | 1000 µV | 1000 µV | 1000 µV | 1000 µV | 1000 µV |
JESD-30 代码 | R-GDFP-F10 | R-GDFP-F10 | R-GDIP-T8 | O-MBCY-W8 | R-GDIP-T8 | O-MBCY-W8 |
JESD-609代码 | e0 | e3 | e3 | e3 | e0 | e0 |
负供电电压上限 | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED | METAL |
封装代码 | QFF | QFF | DIP | TO-5 | DIP | TO-5 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | RECTANGULAR | ROUND |
封装形式 | FLATPACK | FLATPACK | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | 250 | 250 | 250 | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
供电电压上限 | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | NO | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | MATTE TIN | MATTE TIN | MATTE TIN | TIN LEAD | TIN LEAD |
端子形式 | FLAT | FLAT | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE |
端子位置 | DUAL | DUAL | DUAL | BOTTOM | DUAL | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
座面最大高度 | 2.29 mm | 2.29 mm | 5.08 mm | - | 5.08 mm | - |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | - |
宽度 | 6.35 mm | 6.35 mm | 7.62 mm | - | 7.62 mm | - |
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