KMM965G112APN-G7概述

Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144

KMM965G112APN-G7规格参数

参数名称	属性值
厂商名称	SAMSUNG(三星)
零件包装代码	SODIMM
包装说明	DIMM, DIMM144,32
针数	144
Reach Compliance Code	unknown
ECCN代码	EAR99
访问模式	DUAL BANK PAGE BURST
最长访问时间	5.5 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	143 MHz
I/O 类型	COMMON
JESD-30 代码	R-XZMA-N144
内存密度	67108864 bit
内存集成电路类型	SYNCHRONOUS GRAPHICS RAM MODULE
内存宽度	64
功能数量	1
端口数量	1
端子数量	144
字数	1048576 words
字数代码	1000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	1MX64
输出特性	3-STATE
封装主体材料	UNSPECIFIED
封装代码	DIMM
封装等效代码	DIMM144,32
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
电源	3.3 V
认证状态	Not Qualified
刷新周期	2048
自我刷新	YES
最大待机电流	0.008 A
最大压摆率	0.64 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	NO LEAD
端子节距	0.8 mm
端子位置	ZIG-ZAG

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SGRAM MODULE

KMM965G112AQ(P)N / KMM966G112AQ(P)N

8MB SGRAM MODULE

(1Mx64 SODIMM based on 512Kx32 SGRAM)

Unbuffered SGRAM

Graphics

64-bit Non-ECC/Parity

144-pin SODIMM

Revision 0.0

July 1999

-1-

ELECTRONICS

Rev. 0.0 (Jul. 1999)

KMM965G112APN-G7相似产品对比

	KMM965G112APN-G7	KMM965G112AQN-G5	KMM965G112AQN-G7	KMM965G112APN-G8	KMM965G112AQN-G8	KMM965G112APN-G6	KMM965G112APN-G5	KMM965G112AQN-G6
描述	Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 4.5ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 6ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 6ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 4.5ns, CMOS, SODIMM-144	Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144
零件包装代码	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM
包装说明	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32
针数	144	144	144	144	144	144	144	144
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
最长访问时间	5.5 ns	4.5 ns	5.5 ns	6 ns	6 ns	5.5 ns	4.5 ns	5.5 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	143 MHz	200 MHz	143 MHz	125 MHz	125 MHz	166 MHz	200 MHz	166 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144
内存密度	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
内存集成电路类型	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE	SYNCHRONOUS GRAPHICS RAM MODULE
内存宽度	64	64	64	64	64	64	64	64
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	144	144	144	144	144	144	144	144
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	1MX64	1MX64	1MX64	1MX64	1MX64	1MX64	1MX64	1MX64
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
封装等效代码	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	2048	2048	2048	2048	2048	2048	2048	2048
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES
最大待机电流	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
最大压摆率	0.64 mA	0.8 mA	0.64 mA	0.6 mA	0.6 mA	0.72 mA	0.8 mA	0.72 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG
厂商名称	SAMSUNG(三星)	SAMSUNG(三星)	-	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)

KMM965G112APN-G7

KMM965G112APN-G7概述

KMM965G112APN-G7规格参数

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KMM965G112APN-G7相似产品对比

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