ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Objectid | 1402340974 |
包装说明 | DIP, DIP24,.3 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 5 V |
最小模拟输入电压 | |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
最大线性误差 (EL) | 0.39% |
模拟输入通道数量 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 75 °C |
最低工作温度 | -20 °C |
输出位码 | BINARY |
输出格式 | PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
采样速率 | 40 MHz |
采样并保持/跟踪并保持 | TRACK |
最大压摆率 | 80 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
TMC1175N2C40 | TMC1175N2C20 | TMC1175M7C30 | TMC1175R3C20 | TMC1175R3C30 | TMC1175R3C40 | TMC1175N2C30 | TMC1175AM7C20 | TMC1175AN2C20 | |
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描述 | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24, | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24, | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDSO24, | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PQCC28, | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PQCC28, | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PQCC28, | ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24, | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO24, | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 2.6 V | 2.6 V |
转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
最大线性误差 (EL) | 0.39% | 0.39% | 0.39% | 0.39% | 0.39% | 0.39% | 0.39% | 0.293% | 0.293% |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 28 | 28 | 28 | 24 | 24 | 24 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | QCCJ | QCCJ | QCCJ | DIP | SOP | DIP |
封装等效代码 | DIP24,.3 | DIP24,.3 | SOP24,.3 | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | DIP24,.3 | SOP24,.3 | DIP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 40 MHz | 20 MHz | 30 MHz | 20 MHz | 30 MHz | 40 MHz | 30 MHz | 20 MHz | 20 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
最大压摆率 | 80 mA | 60 mA | 70 mA | 60 mA | 70 mA | 80 mA | 70 mA | 30 mA | 30 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | J BEND | J BEND | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL |
包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.3 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | SOP, SOP24,.3 | - |
厂商名称 | - | - | Raytheon Company | Raytheon Company | Raytheon Company | Raytheon Company | - | Raytheon Company | - |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
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