EEPROM, 8KX8, Serial
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | DIE |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 1 MHz |
| JESD-30 代码 | X-XUUC-N |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 最长写入周期时间 (tWC) | 5 ms |
| AT24C64D-WWU11M | AT24C64D-XHM-T | AT24C64D-SSHM-B | AT24C64D-MEHM-T | AT24C64D-CUM-T | AT24C64D-U1UM0B-T | |
|---|---|---|---|---|---|---|
| 描述 | EEPROM, 8KX8, Serial | 存储器接口类型：I2C 存储器容量：64Kb (8K x 8) 工作电压：1.7V ~ 5.5V 存储器类型：Non-Volatile | 存储器接口类型：I2C 存储器容量：64Kb (8K x 8) 工作电压：1.7V ~ 5.5V 存储器类型：Non-Volatile | EEPROM, 8KX8, Serial | EEPROM, 8KX8, Serial, PBGA8 | EEPROM, 8KX8, Serial, CMOS, PBGA5 |
| 包装说明 | DIE | 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | VSON, SOLCC8,.08,16 | 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | 3 X 3 MM, 0.40 MM PITCH, GREEN, WLCSP-5 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | X-XUUC-N | R-PDSO-G8 | R-PDSO-G8 | R-XDSO-N8 | R-PBGA-B8 | S-PBGA-B5 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIE | TSSOP | SOP | VSON | VFBGA | VFBGA |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | BALL | BALL |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 厂商名称 | Microchip(微芯科技) | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | - |
| 数据保留时间-最小值 | - | 100 | 100 | 100 | 100 | - |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| I2C控制字节 | - | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | - |
| JESD-609代码 | - | e4 | e4 | e4 | e3 | - |
| 长度 | - | 4.4 mm | 4.925 mm | 2.2 mm | 2 mm | 3 mm |
| 端子数量 | - | 8 | 8 | 8 | 8 | 5 |
| 封装等效代码 | - | TSSOP8,.25 | SOP8,.25 | SOLCC8,.08,16 | BGA8,2X4,40/20 | - |
| 电源 | - | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | - |
| 座面最大高度 | - | 1.2 mm | 1.75 mm | 0.4 mm | 0.85 mm | 0.33 mm |
| 最大待机电流 | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | - |
| 最大压摆率 | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | MATTE TIN | - |
| 端子节距 | - | 0.65 mm | 1.27 mm | 0.4 mm | 0.5 mm | 0.4 mm |
| 宽度 | - | 3 mm | 3.9 mm | 1.8 mm | 1.5 mm | 3 mm |
| 写保护 | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | - |
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