IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| Reach Compliance Code | not_compliant |
| 位大小 | 8 |
| CPU系列 | ST72 |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP64,.66SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 512 |
| ROM（单词） | 16384 |
| ROM可编程性 | MROM |
| 速度 | 8 MHz |
| 最大压摆率 | 20 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| ST72311R4Q6 | ST72T311N9B6 | ST72311R6Q6 | ST72E311R9G0 | ST72E311N9D0 | ST72311N5B6 | ST72311N6B6 | ST72311R5Q6 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,42PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,56PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,56PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,56PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 |
| JESD-30 代码 | S-PQFP-G64 | R-PDIP-T42 | S-PQFP-G64 | S-XQFP-G64 | R-XDIP-T56 | R-PDIP-T56 | R-PDIP-T56 | S-PQFP-G64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 64 | 42 | 64 | 64 | 56 | 56 | 56 | 64 |
| 片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | SDIP | QFP | QFP | SDIP | SDIP | SDIP | QFP |
| 封装等效代码 | QFP64,.66SQ,32 | SDIP42,.6 | QFP64,.66SQ,32 | QFP64,.66SQ,32 | SDIP56,.6 | SDIP56,.6 | SDIP56,.6 | QFP64,.66SQ,32 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 512 | 3072 | 768 | 3072 | 3072 | 512 | 768 | 512 |
| ROM（单词） | 16384 | 61440 | 32768 | 61440 | 61440 | 24576 | 32768 | 24576 |
| ROM可编程性 | MROM | UVPROM | UVPROM | UVPROM | UVPROM | MROM | MROM | MROM |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大压摆率 | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.8 mm | 1.78 mm | 0.8 mm | 0.8 mm | 1.78 mm | 1.78 mm | 1.78 mm | 0.8 mm |
| 端子位置 | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD |
| 厂商名称 | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
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