High Speed Operational Amplifiers Dual Lo-Pwr Hi-Spd Fixed Gain
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | MSOP |
| 包装说明 | TSSOP, |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| OPA2832IDGKRG4 | OPA2832ID | OPA2832IDGKT | OPA2832IDR | OPA2832IDGKTG4 | OPA2832IDGKR | |
|---|---|---|---|---|---|---|
| 描述 | High Speed Operational Amplifiers Dual Lo-Pwr Hi-Spd Fixed Gain | Dual, Low Power, High-Speed , Fixed Gain Operational Amplifier 8-SOIC -40 to 85 | Dual, Low Power, High-Speed , Fixed Gain Operational Amplifier 8-VSSOP -40 to 85 | Dual, Low Power, High-Speed , Fixed Gain Operational Amplifier 8-SOIC -40 to 85 | Dual, Low Power, High-Speed , Fixed Gain Operational Amplifier 8-VSSOP -40 to 85 | High Speed Operational Amplifiers Dual, Low Power, High-Speed , Fixed Gain Operational Amplifier 8-VSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | MSOP | SOIC | MSOP | SOIC | MSOP | MSOP |
| 包装说明 | TSSOP, | SOP, | TSSOP, | SOIC-8 | TSSOP, | TSSOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknow | compli | compli | compli | compli | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | - | 含铅 |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 放大器类型 | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | - |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | - |
| 长度 | - | 4.905 mm | 3 mm | 4.905 mm | 3 mm | - |
| 湿度敏感等级 | - | 2 | 2 | 2 | 2 | - |
| 功能数量 | - | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 8 | 8 | 8 | 8 | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | SOP | TSSOP | SOP | TSSOP | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 1.75 mm | 1.1 mm | 1.75 mm | 1.1 mm | - |
| 表面贴装 | - | YES | YES | YES | YES | - |
| 技术 | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | - | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 3.895 mm | 3 mm | 3.895 mm | 3 mm | - |
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