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GT28F128W18B85

产品描述Flash, 8MX16, 85ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56
产品类别存储    存储   
文件大小598KB,共86页
制造商Intel(英特尔)
官网地址http://www.intel.com/
下载文档 详细参数 选型对比 全文预览

GT28F128W18B85概述

Flash, 8MX16, 85ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56

GT28F128W18B85规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码BGA
包装说明VFBGA, BGA56,7X8,30
针数56
Reach Compliance Codeunknow
ECCN代码3A991.B.1.A
最长访问时间85 ns
其他特性ALSO SUPPORTS SYNCHRONOUS OPERATION
启动块BOTTOM
命令用户界面YES
通用闪存接口YES
数据轮询NO
JESD-30 代码R-PBGA-B56
JESD-609代码e0
长度9 mm
内存密度134217728 bi
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模8, 255
端子数量56
字数8388608 words
字数代码8000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8MX16
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA56,7X8,30
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
页面大小4 words
并行/串行PARALLEL
电源1.8 V
编程电压1.8 V
认证状态Not Qualified
座面最大高度1 mm
部门规模4K,32K
最大待机电流0.000005 A
最大压摆率0.04 mA
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.75 mm
端子位置BOTTOM
切换位NO
类型NOR TYPE
宽度7.7 mm
Base Number Matches1

文档预览

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1.8 Volt Intel
®
Wireless Flash Memory
(W18)
28F320W18, 28F640W18, 28F128W18
Preliminary Datasheet
Product Features
High Performance
— 70 ns Initial Access Speed
— 14 ns Clock to Data Output Zero Wait-State
Synchronous Burst Mode
— 20 ns Page Mode Read Speed
— 4-, 8-, and Continuous Word Burst Modes
— Burst and Page Modes in Both Parameter and
Main Partitions
— Programmable WAIT Configuration
— Enhanced Factory Programming Mode:
3.50 µs/Word (Typ)
— Glueless 12 V interface for Fast Factory
Programming @ 8 µs/Word (Typ)
— 1.8 V Low-Power Programming @ 12 µs/Word
(Typ)
— Program or Erase during Reads
s
Architecture
— Multiple 4-Mbit Partitions
— Dual-Operation: RWW or RWE (Read-While -
Write or Read-While-Erase)
— Eight, 4-Kword Parameter Code/Data Blocks
— 32-Kword Main Code/Data Blocks
— Top and Bottom Parameter Configurations
s
Power Operation
— 1.65 V to 1.95 V Read and Write Operations
— 1.7 V to 2.24 V V
CCQ
for I/O Isolation
— Standby Current: 5 µA (Typ)
— 40/52/66 MHz 4-word Sync Read
Current: 7 mA (Typ)
s
Software
— 5 µs (Typ) Program Suspend
— 5 µs (Typ) Erase Suspend
— Intel
®
Flash Data Integrator (IFDI) Software
Optimized
— Intel Basic Command Set Compatible
— Common Flash Interface (CFI)
s
Quality and Reliability
— Extended Temperature –40 °C to +85 °C
— Minimum 100K Block Erase Cycles
— ETOX™ VII Flash Technology (0.18 µm)
s
Security
— Two 64-bit Protection Registers: 64 Unique
Device Identifier Bits; 64 User-Programmable
OTP Bits
— Absolute Write Protection
⇒V
PP
= GND
— Erase/Program Lockout during Power
Transitions
— Individual Dynamic Zero-Latency Block
Locking
s
Density and Packaging
— 32-Mbit in a VF BGA Package
— 64-Mbit and 128-Mbit in
µBGA*Package
— 56 Active Ball Matrix, 0.75 mm Ball-Pitch
µBGA*
and VF BGA Packages
— 16-Bit Wide Data Bus
s
The 1.8 Volt Intel
®
Wireless Flash memory with flexible multi-partition dual-operation provides high-
performance asynchronous and synchronous burst reads. It is an ideal memory for low-voltage burst CPUs.
Combining high read performance with flash memory’s intrinsic non-volatility, 1.8 Volt Intel
®
Wireless Flash
memory eliminates the traditional system-performance paradigm of shadowing redundant code memory from
slow nonvolatile storage to faster execution memory. It reduces the total memory requirement that increases
reliability and reduces overall system power consumption and cost.
The 1.8 Volt Intel
®
Wireless Flash memory’s flexible multi-partition architecture allows programming or erasing
to occur in one partition while reading from another partition. This allows for higher data write throughput
compared to single partition architectures. The dual-operation architecture also allows two processors to
interleave code operations while program and erase operations take place in the background. The designer can
also choose the size of the code and data partitions via the flexible multi-partition architecture.
The 1.8 Volt Intel
®
Wireless Flash memory is manufactured on Intel
®
0.18 µm ETOX™ VII process technology.
It is available in µBGA and VF BGA packages, which are ideal for board-constrained applications.
Notice:
This document contains preliminary information on new products in production. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.
Order Number:
290701-002
January 2001

GT28F128W18B85相似产品对比

GT28F128W18B85 GT28F128W18T85 ATS-14A-189-C2-R0 GT28F128W18B70
描述 Flash, 8MX16, 85ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56 Flash, 8MX16, 85ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56 pushPIN™ HS ASMBLY,COARSE-PITCH,STRAIGHT, HOLE PATTERN:RIGHT-TABBED,BLUE,T766 Flash, 8MX16, 70ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56
是否Rohs认证 不符合 不符合 - 不符合
零件包装代码 BGA BGA - BGA
包装说明 VFBGA, BGA56,7X8,30 0.75 MM PITCH, CSP, MICRO, BGA-56 - VFBGA, BGA56,7X8,30
针数 56 56 - 56
Reach Compliance Code unknow unknow - unknown
ECCN代码 3A991.B.1.A 3A991.B.1.A - 3A991.B.1.A
最长访问时间 85 ns 85 ns - 70 ns
其他特性 ALSO SUPPORTS SYNCHRONOUS OPERATION ALSO SUPPORTS SYNCHRONOUS OPERATION - ALSO SUPPORTS SYNCHRONOUS OPERATION
启动块 BOTTOM TOP - BOTTOM
命令用户界面 YES YES - YES
通用闪存接口 YES YES - YES
数据轮询 NO NO - NO
JESD-30 代码 R-PBGA-B56 R-PBGA-B56 - R-PBGA-B56
JESD-609代码 e0 e0 - e0
长度 9 mm 9 mm - 9 mm
内存密度 134217728 bi 134217728 bi - 134217728 bit
内存集成电路类型 FLASH FLASH - FLASH
内存宽度 16 16 - 16
功能数量 1 1 - 1
部门数/规模 8, 255 8, 255 - 8, 255
端子数量 56 56 - 56
字数 8388608 words 8388608 words - 8388608 words
字数代码 8000000 8000000 - 8000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
最高工作温度 85 °C 85 °C - 85 °C
最低工作温度 -40 °C -40 °C - -40 °C
组织 8MX16 8MX16 - 8MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 VFBGA VFBGA - VFBGA
封装等效代码 BGA56,7X8,30 BGA56,7X8,30 - BGA56,7X8,30
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH
页面大小 4 words 4 words - 4 words
并行/串行 PARALLEL PARALLEL - PARALLEL
电源 1.8 V 1.8 V - 1.8 V
编程电压 1.8 V 1.8 V - 1.8 V
认证状态 Not Qualified Not Qualified - Not Qualified
座面最大高度 1 mm 1 mm - 1 mm
部门规模 4K,32K 4K,32K - 4K,32K
最大待机电流 0.000005 A 0.000005 A - 0.000005 A
最大压摆率 0.04 mA 0.04 mA - 0.04 mA
最大供电电压 (Vsup) 1.95 V 1.95 V - 1.95 V
最小供电电压 (Vsup) 1.7 V 1.7 V - 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V - 1.8 V
表面贴装 YES YES - YES
技术 CMOS CMOS - CMOS
温度等级 INDUSTRIAL INDUSTRIAL - INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
端子形式 BALL BALL - BALL
端子节距 0.75 mm 0.75 mm - 0.75 mm
端子位置 BOTTOM BOTTOM - BOTTOM
切换位 NO NO - NO
类型 NOR TYPE NOR TYPE - NOR TYPE
宽度 7.7 mm 7.7 mm - 7.7 mm
Base Number Matches 1 1 - 1

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