IC 4000/14000/40000 SERIES, 64-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, Shift Register
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
包装说明 | CERAMIC, DIP-16 |
Reach Compliance Code | unknown |
其他特性 | DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING |
计数方向 | RIGHT |
系列 | 4000/14000/40000 |
JESD-30 代码 | R-GDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.43 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | SERIAL IN SERIAL OUT |
位数 | 64 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5/15 V |
传播延迟(tpd) | 600 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 15 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 7.62 mm |
最小 fmax | 1.6 MHz |
CD4031BMJ | CD4031BCN | CD4031BCJ | |
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描述 | IC 4000/14000/40000 SERIES, 64-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, Shift Register | IC 4000/14000/40000 SERIES, 64-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, Shift Register | IC 4000/14000/40000 SERIES, 64-BIT RIGHT SERIAL IN SERIAL OUT SHIFT REGISTER, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, Shift Register |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
包装说明 | CERAMIC, DIP-16 | PLASTIC, DIP-16 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown |
其他特性 | DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING | DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING | DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING |
计数方向 | RIGHT | RIGHT | RIGHT |
系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 代码 | R-GDIP-T16 | R-PDIP-T16 | R-GDIP-T16 |
JESD-609代码 | e0 | e0 | e0 |
长度 | 19.43 mm | 19.305 mm | 19.43 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT |
位数 | 64 | 64 | 64 |
功能数量 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5/15 V | 5/15 V | 5/15 V |
传播延迟(tpd) | 600 ns | 600 ns | 600 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 15 V | 15 V | 15 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO |
技术 | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm |
最小 fmax | 1.6 MHz | 1.6 MHz | 1.6 MHz |
Base Number Matches | - | 1 | 1 |
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