Flash PLD, 24ns, CMOS, CQCC84, CERAMIC, LCC-84
| 参数名称 | 属性值 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, |
| 针数 | 84 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大时钟频率 | 50 MHz |
| JESD-30 代码 | S-CQCC-J84 |
| 专用输入次数 | 1 |
| I/O 线路数量 | 64 |
| 端子数量 | 84 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1 DEDICATED INPUTS, 64 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | FLASH PLD |
| 传播延迟 | 24 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | J BEND |
| 端子位置 | QUAD |
| 5962-9759801QYX | 5962-9759802QYX | 5962-9759802QXX | 5962-9759802QXA | 5962-9759801QXX | |
|---|---|---|---|---|---|
| 描述 | Flash PLD, 24ns, CMOS, CQCC84, CERAMIC, LCC-84 | Flash PLD, 19ns, CMOS, CQCC84, CERAMIC, LCC-84 | Flash PLD, 19ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84 | Flash PLD, 19ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84 | Flash PLD, 24ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84 |
| 零件包装代码 | LCC | LCC | PGA | PGA | PGA |
| 包装说明 | QCCJ, | QCCJ, | PGA, | PGA, | PGA, |
| 针数 | 84 | 84 | 84 | 84 | 84 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大时钟频率 | 50 MHz | 67.5 MHz | 67.5 MHz | 67.5 MHz | 50 MHz |
| JESD-30 代码 | S-CQCC-J84 | S-CQCC-J84 | S-CPGA-P84 | S-CPGA-P84 | S-CPGA-P84 |
| 专用输入次数 | 1 | 1 | 1 | 1 | 1 |
| I/O 线路数量 | 64 | 64 | 64 | 64 | 64 |
| 端子数量 | 84 | 84 | 84 | 84 | 84 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 1 DEDICATED INPUTS, 64 I/O | 1 DEDICATED INPUTS, 64 I/O | 1 DEDICATED INPUTS, 64 I/O | 1 DEDICATED INPUTS, 64 I/O | 1 DEDICATED INPUTS, 64 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | QCCJ | PGA | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 传播延迟 | 24 ns | 19 ns | 19 ns | 19 ns | 24 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | J BEND | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子位置 | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
模拟与混合信号
嵌入式系统
电源技术
微控制器 MCU
PCB设计
模拟电子
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
