Super small Flat Lead Package (SFP) is suitable for surface mount design.
Ordering Information
Type No.
HVD358B
Laser Mark
C
Package Name
SFP
Package Code
PUSF0002ZB-A
Pin Arrangement
Cathode mark
Mark
1
C
2
1. Cathode
2. Anode
Rev.2.00 Jan 24, 2006 page 1 of 4
HVD358B
Absolute Maximum Ratings
(Ta = 25°C)
Item
Reverse voltage
Junction temperature
Storage temperature
Symbol
V
R
Tj
Tstg
Value
15
125
−55
to +125
Unit
V
°C
°C
Electrical Characteristics
(Ta = 25°C)
Item
Reverse current
Capacitance
Capacitance ratio
Series resistance
Symbol
I
R1
I
R2
C
1
C
4
n
r
S
Min
—
—
19.5
8.00
2.20
—
Typ
—
—
—
—
—
—
Max
10
100
21.0
9.30
—
0.40
Unit
nA
pF
—
Ω
Test Condition
V
R
= 15 V
V
R
= 15 V, Ta = 60°C
V
R
= 1 V, f = 1 MHz
V
R
= 4 V, f = 1 MHz
C
1
/ C
4
V
R
= 1 V, f = 470 MHz
Note: For SFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is
considered as unquestioned. Please kindly consider soldering nature.
Rev.2.00 Jan 24, 2006 page 2 of 4
HVD358B
Main Characteristic
10
−8
10
−9
30
f=1MHz
25
Reverse current I
R
(A)
10
−10
10
−11
10
−12
10
−13
10
−14
10
−15
Capacitance C (pF)
0
4
8
12
16
20
20
15
10
5
0
0.1
1.0
Reverse voltage V
R
(V)
10
Reverse voltage V
R
(V)
Fig.1 Reverse current vs. Reverse voltage
Fig.2 Capacitance vs. Reverse voltage
0.4
f=470MHz
0
Series resistance r
S
(Ω)
L
F
=
∆(LogC)/∆(LogV
R
)
10
0.3
-0.5
0.2
-1.0
0.1
0
0.1
1.0
Reverse voltage V
R
(V)
-1.5
0.1
1.0
Reverse voltage V
R
(V)
Fig.4 L
F
vs. Reverse voltage
10
Fig.3 Series resistance vs. Reverse voltage
Rev.2.00 Jan 24, 2006 page 3 of 4
HVD358B
Package Dimensions
Package Name
SFP
JEITA Package Code
RENESAS Code
PUSF0002ZB-A
Previous Code
SFP / SFPV
MASS[Typ.]
0.0010g
D
b
E
H
E
c
A
φ
b
e
1
Reference
Symbol
Dimension in Millimeters
Pattern of terminal position areas
A
b
c
D
E
H
E
φ
b
e
1
Min
0.50
0.25
0.08
0.55
0.90
1.30
Nom
0.30
0.13
0.60
1.00
1.40
0.50
1.40
Max
0.55
0.35
0.18
0.65
1.10
1.50
Rev.2.00 Jan 24, 2006 page 4 of 4
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