Datasheet> 器件分类 > 存储> 存储> GT28F160C2TA100

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GT28F160C2TA100: 产品描述Flash, 1MX16, 100ns, PBGA48, CSP, MICRO, BGA-48; 产品类别存储存储; 文件大小271KB，共56页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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GT28F160C2TA100概述

Flash, 1MX16, 100ns, PBGA48, CSP, MICRO, BGA-48

GT28F160C2TA100规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	BGA
包装说明	CSP, MICRO, BGA-48
针数	48
Reach Compliance Code	compli
ECCN代码	EAR99
最长访问时间	100 ns
其他特性	TOP BOOT BLOCK
启动块	TOP
命令用户界面	YES
通用闪存接口	YES
数据轮询	NO
JESD-30 代码	R-PBGA-B48
JESD-609代码	e0
长度	9.81 mm
内存密度	16777216 bi
内存集成电路类型	FLASH
内存宽度	16
功能数量	1
部门数/规模	8,31
端子数量	48
字数	1048576 words
字数代码	1000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	1MX16
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装等效代码	BGA48,6X8,30
封装形状	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2.4/3 V
编程电压	1.8 V
认证状态	Not Qualified
座面最大高度	1 mm
部门规模	4K,32K
最大待机电流	0.000005 A
最大压摆率	0.055 mA
最大供电电压 (Vsup)	3 V
最小供电电压 (Vsup)	2.4 V
标称供电电压 (Vsup)	2.4 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
切换位	NO
类型	NOR TYPE
宽度	7.58 mm
Base Number Matches	1

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PRELIMINARY

2.4 VOLT ADVANCED+ BOOT BLOCK

FLASH MEMORY

28F800C2, 28F160C2 (x16)

Flexible SmartVoltage Technology



2.4 V–3.0 V Read/Program/Erase



12 V for Fast Production

Programming

High Performance



2.4 V–3.0 V: 100 ns Max Access

Time



2.7 V–3.0 V: 90 ns Max Access Time

Optimized Architecture for Code Plus

Data Storage



Eight 4- Kword Blocks,

Top or Bottom Locations



Up to Sixty-Three 32-Kword Blocks



Fast Program Suspend Capability



Fast Erase Suspend Capability

Flexible Block Locking



Lock/Unlock Any Block



Full Protection on Power-Up



WP# Pin for Hardware Block

Protection



GND Option



Lockout Voltage

Low Power Consumption



8 mA Typical Read Power



10 µA Typical Standby Power with

Automatic Power Savings Feature

Extended Temperature Operation



–40 °C to +85 °C

Improved 12 V Production

Programming



Faster Production Programming



No Additional System Logic

128-bit Protection Register



64-bit Unique Device Identifier



64-bit User Programmable OTP

Cells

Extended Cycling Capability



Minimum 100,000 Block Erase

Cycles

Supports Flash Data Integrator

Software



Flash Memory Manager



System Interrupt Manager



Supports Parameter Storage,

Streaming Data (e.g., voice)

Automated Word/Byte Program and

Block Erase



Command User Interface



Status Registers

Cross-Compatible Command Support



Intel Basic Command Set



Common Flash Interface

x16 I/O for Various Applications



48-Ball

µBGA*

Package



48-Lead TSOP Package

0.25

ETOX™ VI Flash Technology

The 0.25 µm 2.4 Volt Advanced+ Boot Block flash memory, manufactured on Intel’s latest 0.25 µ technology,

represents a feature-rich solution for low power applications. These flash memory devices incorporate low

voltage capability (2.4 V read, program and erase) with high-speed, low-power operation. Flexible block

locking allows any block to be independently locked or unlocked. A 128-bit protection register enhances

customers’ ability to develop secure systems. Add to this the Intel-developed Flash Data Integrator (FDI)

software and you have a cost-effective, flexible, monolithic code plus data storage solution. 2.4 Volt

Advanced+ Boot Block products will be available in 48-lead TSOP and 48-ball µBGA* packages. All devices

have a 16-bit data bus. Additional information on this product family can be obtained by accessing Intel’s

Flash website: http://www.intel.com/design/flash.

June 1999

Order Number: 290647-002

GT28F160C2TA100相似产品对比

	GT28F160C2TA100	GT28F160C2BA100	GT28F160C2BA120	TE28F160C2TA120	TE28F160C2BA100	TE28F160C2BA120	TE28F160C2TA100	TE28F800C2BA100	TE28F800C2TA100	TE28F800C2TA120
描述	Flash, 1MX16, 100ns, PBGA48, CSP, MICRO, BGA-48	Flash, 1MX16, 100ns, PBGA48, CSP, MICRO, BGA-48	Flash, 1MX16, 120ns, PBGA48, CSP, MICRO, BGA-48	Flash, 1MX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 1MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 1MX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 1MX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 512KX16, 120ns, PDSO48, 12 X 20 MM, TSOP-48
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	TSOP	TSOP	TSOP	TSOP	TSOP	TSOP	TSOP
包装说明	CSP, MICRO, BGA-48	VFBGA, BGA48,6X8,30	VFBGA, BGA48,6X8,30	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48	12 X 20 MM, TSOP-48
针数	48	48	48	48	48	48	48	48	48	48
Reach Compliance Code	compli	compli	compli	unknow	unknow	unknow	unknow	compli	compli	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	100 ns	100 ns	120 ns	120 ns	100 ns	120 ns	100 ns	100 ns	100 ns	120 ns
其他特性	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	TOP BOOT BLOCK
启动块	TOP	BOTTOM	BOTTOM	TOP	BOTTOM	BOTTOM	TOP	BOTTOM	TOP	TOP
命令用户界面	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
通用闪存接口	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
数据轮询	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 代码	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	9.81 mm	9.81 mm	9.81 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm
内存密度	16777216 bi	16777216 bi	16777216 bi	16777216 bi	16777216 bi	16777216 bi	16777216 bi	8388608 bi	8388608 bi	8388608 bi
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
部门数/规模	8,31	8,31	8,31	8,31	8,31	8,31	8,31	8,15	8,15	8,15
端子数量	48	48	48	48	48	48	48	48	48	48
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	524288 words	524288 words	524288 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	1000000	512000	512000	512000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	512KX16	512KX16	512KX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
封装等效代码	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP48,.8,20
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V	2.4/3 V
编程电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1 mm	1 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
部门规模	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K	4K,32K
最大待机电流	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
最大压摆率	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA
最大供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
最小供电电压 (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
标称供电电压 (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.75 mm	0.75 mm	0.75 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
切换位	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	7.58 mm	7.58 mm	7.58 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm
Base Number Matches	1	1	1	1	1	1	1	1	1	1

GT28F160C2TA100

GT28F160C2TA100概述

GT28F160C2TA100规格参数

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GT28F160C2TA100相似产品对比

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