Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
包装说明 | , |
Reach Compliance Code | compliant |
系列 | P |
JESD-30 代码 | R-XZMA-T75 |
JESD-609代码 | e0 |
逻辑集成电路类型 | BUS DRIVER |
位数 | 8 |
功能数量 | 4 |
端口数量 | 2 |
端子数量 | 75 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 6.5 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子位置 | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
IDT7MP9244T | IDT7MP9244CT | IDT7MP9245CT | IDT7MP9245T | IDT7MP9245AT | IDT7MP9244AT | |
---|---|---|---|---|---|---|
描述 | Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Transceiver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Transceiver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
系列 | P | P | P | P | P | P |
JESD-30 代码 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | BUS DRIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 18 | 18 | 18 | 8 |
功能数量 | 4 | 4 | 2 | 2 | 2 | 4 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 75 | 75 | 75 | 75 | 75 | 75 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 6.5 ns | 4.1 ns | 4.1 ns | 7 ns | 4.6 ns | 4.8 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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