209CNQ SERIES
Technical Data
Data Sheet N1240, Rev. B
209CNQ135/209CNQ150
SCHOTTKY RECTIFIER
Features
175℃ T
J
operation
Center tap module
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
Low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
PRM4 (Non-Isolated)
Additional testing can be offered upon request
Circuit Diagram
Applications
High current switching power supply
Plating power supply
Free-Wheeling diodes
Reverse battery protection
Converters
UPS System
Welding
Maximum Ratings:
Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Peak One Cycle Non-Repetitive
Surge Current (Per Leg)
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FSM
Condition
-
50% duty cycle @T
C
=110°C,
rectangular wave form
8.3 ms, half Sine pulse
135
150
Max.
209CNQ135
209CNQ150
100(Per Leg)
200(Per Device)
1440
Units
V
A
A
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209CNQ SERIES
Technical Data
Data Sheet N1240, Rev. B
Electrical Characteristics:
Characteristics
Forward Voltage Drop(Per Leg)*
Symbol
V
F1
V
F2
Condition
@ 100A, Pulse, T
J
= 25
C
@ 200A, Pulse, T
J
= 25
C
@ 100A, Pulse, T
J
= 125
C
@ 200A, Pulse, T
J
= 125
C
@V
R
= rated V
R,
T
J
= 25
C
@V
R
= rated V
R,
T
J
= 125
C
@V
R
= 5V, T
C
= 25
C
f
SIG
= 1MHz
-
Typ.
0.79
-
0.62
-
0.002
0.7
2300
-
Max.
1.03
1.22
0.71
0.82
3
45
3000
10,000
Units
V
V
Reverse Current(Per Leg)*
Junction Capacitance(Per leg)
Voltage Rate of Change
* Pulse width < 300 µs, duty cycle < 2%
I
R1
I
R2
C
T
dv/dt
mA
mA
pF
V/s
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Case(Per leg)
Typical Thermal Resistance Junction to
Case(Per package)
Typical Thermal Resistance, case to
Heat Sink
Mounting Torque
Approximate Weight
Case Style
Symbol
T
J
T
stg
R
JC
R
JC
R
cs
Condition
-
-
DC operation
DC operation
Mounting surface, smooth
and greased
-
-
Specification
-55 to +175
-55 to +175
0.50
0.25
0.10
Mounting
Torque
Terminal
Torque
24(min)
35(max)
35(min)
46(max)
Units
C
C
C/W
C/W
C/W
TM
wt
Kg-cm
g
PRM4 Non-Isolated
79
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209CNQ SERIES
Technical Data
Data Sheet N1240, Rev. B
Ratings and Characteristics Curves
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209CNQ SERIES
Technical Data
Data Sheet N1240, Rev. B
Mechanical Dimensions PRM4 Non-Isolated(Millimeters/Inches)
Marking Diagram
Ordering Information
Device
209CNQ SERIES
Package
PRM4(Non- Isolated)
(Pb-Free)
Shipping
9 pcs/box
Where XXXX is YYWW
209CNQ135
SS
YY
WW
= Part name
= SS
= Year
= Week
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
Cautions：Molding
resin
Epoxy resin UL:94V-0
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209CNQ SERIES
Technical Data
Data Sheet N1240, Rev. B
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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