FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-29137-3E
Spread Spectrum Clock Generator
MB88163
■
DESCRIPTION
MB88163 is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary
radiation noise (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically
with the internal modulator.
■
FEATURES
•
•
•
•
•
•
Package
Low current consumption
Power supply voltage
Modulation rate
Modulation clock output Duty
Operating temperature
: SON8 (2.0 mm
×
2.0 mm)
: 3.6 mW@13 MHz (Typ-sample, no load)
: 1.8 V
±
0.15 V
: Selectable from no modulation (0.0%),
±
0.25%,
±
0.5% and
±
1.0%
: 40% to 60%
:
−
40
°C
to
+
85
°C
■
PRODUCT LINEUP
The MB88163 has the following two kinds of line-ups depending on the difference of the input frequency range.
Part number
Input frequency
Multiplication rate
Output frequency
MB881631B
MB881631C
12.5 MHz to 26 MHz
20 MHz to 42 MHz
Multiplied by 1
Multiplied by 1
12.5 MHz to 26 MHz
20 MHz to 42 MHz
Copyright©2009-2011 FUJITSU SEMICONDUCTOR LIMITED All rights reserved
2011.5
MB88163
■
PIN ASSIGNMENT
(TOP VIEW)
OUT
S0
1
8
VSS
S1
2
7
MB88163
VDD
3
6
OE
XIN
4
(LCC-8P-M03)
5
XOUT
■
PIN DESCRIPTION
Pin name
OUT
S0
VDD
XIN
XOUT
OE
S1
VSS
I/O
O
I
⎯
I
O
I
I
⎯
Pin no.
1
2
3
4
5
6
7
8
Description
Modulation clock output pin
Modulation rate setting pin with pull-down resistance (18 kΩ)
Power supply voltage pin
Pin for connection to crystal oscillator / clock input pin
Pin for connection to crystal oscillator
Clock output enable pin with pull-up resistance (18 kΩ)
Modulation rate setting pin with pull-up resistance (18 kΩ)
GND pin
■
PIN SETTING
• S0, S1 : Modulation rate setting
S1
S0
L
L
H
H
L
H
L
H
Modulation rate
No modulation (0.0%)
±
0.25%
±
0.5%
±
1.0%
After turning the power on or when changing the S0 pin and the S1 pin setting, the stabilization wait time of
the modulation clock is required.
The stabilization wait time of the modulation clock takes the maximum value of Lock-Up time in “
■
ELEC-
TRICAL CHARACTERISTICS”.
• OE : Clock output enable setting
OE
Condition
L
H
OUT pin : Hi-Z
Operating
When setting the OE pin to “L”, the internal circuit is operating and only the output stops operating. When
changing the OE pin from “L” to “H”, the desired clock is obtained after T
ZO
in “■ ELECTRICAL CHARACTER-
ISTICS” Output start time after OE entry passes.
2
DS04-29137-3E
MB88163
■
I/O CIRCUIT TYPE
Pin
S1,
OE
18 kΩ
Circuit type
Remarks
• With pull-up resistor (18 kΩ)
• CMOS hysteresis input
S0
• With pull-down resistor (18 kΩ)
• CMOS hysteresis input
18 kΩ
OUT
• CMOS output
• I
OL
=
2 mA
• Hi-Z output at OE= “L”
XIN,
XOUT
1 MΩ
• Oscillation circuit
• Built-in feedback resistance :
1 MΩ (Typ)
XIN
XOUT
DS04-29137-3E
3
MB88163
■
HANDLING DEVICES
(1) Preventing Latch-up
A latch-up can occur if, on this device, (a) a voltage higher than power supply voltage or a voltage lower than
GND is applied to an input or output pin or (b) a voltage higher than the rating is applied between power
supply pin and GND pin. The latch-up, if it occurs, significantly increases the power supply current and may
cause thermal destruction of an element. When you use this device, be very careful not to exceed the
maximum rating.
(2) Handling unused pins
Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or pull-
down resistor.
(3) The attention when the external clock is used
Input the clock to XIN pin, and XOUT pin should be opened when you use the external clock.
Please pay attention so that an overshoot and an undershoot do not occur to an input clock of XIN pin.
(4) Power supply pins
Please design connecting the power supply pin of this device by as low impedance as possible from the
current supply source.
We recommend connecting electrolytic capacitor (about 10
μF)
and the ceramic capacitor (about 0.01
μF)
in parallel between power supply and GND near the device, as a bypass capacitor.
(5) Crystal oscillator circuit
Noise near the XIN and XOUT pins may cause the device to malfunction. Design printed circuit boards so
that electric wiring of XIN or XOUT pin and resonator (or ceramic oscillator) do not intersect other wiring.
Design the printed circuit board that surrounds the XIN and XOUT pins with ground.
4
DS04-29137-3E
MB88163
■
BLOCK DIAGRAM
MB88163 PLL block
1/M
OUT
Reference clock
1/
N
XIN
Phase
comparator
Charge
pump
V/I
Conversion
IDAC
ICO
Modulation clock
output
Loop filter
S0, S1
1/L
Modulation
logic
Modulation rate setting
A glitch-less IDAC (current output D/A converter) provides precise modulation, thereby dramatically
reducing EMI.
DS04-29137-3E
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