Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DFP |
| 包装说明 | CERPACK-24 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| 其他特性 | POWER OFF DISABLE O/P\'S |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F24 |
| JESD-609代码 | e3 |
| 长度 | 15.748 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 15.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.286 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 9.144 mm |
| IDT74FCT841BTEG | IDT74FCT841BTLG | IDT74FCT841DTEG | IDT74FCT841DTLG | IDT74FCT841ATEG | IDT74FCT841ATLG | 250U15B102B2NA | IDT74FCT841CTEG | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CQCC28, LCC-28 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CQCC28, LCC-28 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CQCC28, LCC-28 | Commercial Composition 9mm Diameter Variable Resistors | Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDFP24, CERPACK-24 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) |
| 零件包装代码 | DFP | QLCC | DFP | QLCC | DFP | QLCC | - | DFP |
| 包装说明 | CERPACK-24 | LCC-28 | CERPACK-24 | LCC-28 | CERPACK-24 | LCC-28 | - | CERPACK-24 |
| 针数 | 24 | 28 | 24 | 28 | 24 | 28 | - | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | - | compliant |
| 其他特性 | POWER OFF DISABLE O/P\'S | POWER OFF DISABLE O/P'S | POWER OFF DISABLE O/P'S | POWER OFF DISABLE O/P'S | POWER OFF DISABLE O/P\'S | POWER OFF DISABLE O/P\'S | - | POWER OFF DISABLE O/P\'S |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | - | FCT |
| JESD-30 代码 | R-GDFP-F24 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 | - | R-GDFP-F24 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | - | e3 |
| 长度 | 15.748 mm | 11.4554 mm | 15.748 mm | 11.4554 mm | 15.748 mm | 11.4554 mm | - | 15.748 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | - | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 |
| 端子数量 | 24 | 28 | 24 | 28 | 24 | 28 | - | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | QCCN | DFP | QCCN | DFP | QCCN | - | DFP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | - | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER | - | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | - | 260 |
| 传播延迟（tpd） | 15.5 ns | 15.5 ns | 8 ns | 8 ns | 16 ns | 16 ns | - | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.286 mm | 2.54 mm | 2.286 mm | 2.54 mm | 2.286 mm | 2.54 mm | - | 2.286 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | - | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | - | MATTE TIN |
| 端子形式 | FLAT | NO LEAD | FLAT | NO LEAD | FLAT | NO LEAD | - | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | - | 30 |
| 宽度 | 9.144 mm | 11.4554 mm | 9.144 mm | 11.4554 mm | 9.144 mm | 11.4554 mm | - | 9.144 mm |
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