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HDCP-2000

产品描述Analog Circuit, 1 Func, CMOS, PQFP64, MQFP-64
产品类别模拟混合信号IC    信号电路   
文件大小102KB,共12页
制造商HP(Keysight)
官网地址http://www.semiconductor.agilent.com/
下载文档 详细参数 全文预览

HDCP-2000概述

Analog Circuit, 1 Func, CMOS, PQFP64, MQFP-64

HDCP-2000规格参数

参数名称属性值
厂商名称HP(Keysight)
零件包装代码QFP
包装说明QFP,
针数64
Reach Compliance Codeunknown
其他特性3.3V SUPPLY IS ALSO REQUIRED
模拟集成电路 - 其他类型ANALOG CIRCUIT
JESD-30 代码S-PQFP-G64
长度14 mm
功能数量1
端子数量64
最高工作温度65 °C
最低工作温度-25 °C
封装主体材料PLASTIC/EPOXY
封装代码QFP
封装形状SQUARE
封装形式FLATPACK
认证状态Not Qualified
座面最大高度3 mm
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级OTHER
端子形式GULL WING
端子节距0.8 mm
端子位置QUAD
宽度14 mm

HDCP-2000文档预览

Agilent HDCP-2000
Image Processor
Data Sheet
Features
• High quality image processor—
sophisticated imaging algorithms
• Auto-exposure
• Auto white balance
• Pixel correction
• Versatile image pipeline – fully
programmable Gamma correction
and color balance matrices
• Demosaic
• Color space conversion
• JPEG compression
• Isochronous USB output format, up
to 7.5 Mbits/second
• Reference design and evaluation
kit available – includes USB VGA
camera, PC drivers/software, and
schematics
Sensors Supported
• HDCS-1020 (CIF)
• HDCS-2020 (VGA)
Applications—cameras for:
• PCs
• Workstations
• Laptop
• Internet appliances
Description
The HDCP-2000 image processing
chip operates in conjunction with
the Agilent HDCS family of CMOS
image sensors. Together, the two
chips provide a complete solution
for a USB PC Camera. The HDCP
provides all necessary image
processing to transform the raw
Bayer pixel data output from the
HDCS sensors into a standard
video stream and communicate it
over a USB bus. The HDCP-2000
includes complete auto-exposure
and auto white balance capability
to assure optimal image quality in
any lighting environment.
This image processor component
enables the direct interface of
Agilent’s CMOS image sensors to
the USB bus for a mainstream
USB PC Camera. The combination
of an HDCS sensor with the
HDCP-2000 image processor
yields a complete image capture
solution ideally suited for PC
connected cameras, security
cameras, and handheld devices
that need to capture either still
images or video streams.
A full reference design is available
that incorporates Agilent’s
HDCS-2020 CMOS sensor and this
interface chip along with a USB
interface, lens, and the necessary
software to evaluate the perfor-
mance and capabilities of the
system.
The HDCP-2000 is an image
processor with USB output.
Combined with an HDCS-1020 or
HDCS-2020 CMOS image sensor,
this chip provides all the electron-
ics needed for a USB PC camera. A
Microsoft Windows
©
driver is
provided at no charge or usage fee.
System Overview
The HDCP-2000 provides a com-
plete image processing system. In
addition to a configurable image-
processing block, the HDCP-2000
includes an image sensor control
interface, a JPEG image compres-
sion procedure, two general-
purpose input/output pins and a
USB 1.0 host interface.
Image Processor
The image processor block takes
raw data from the CMOS image
sensor and outputs image frames
ready for JPEG compression.
Figure 1 outlines the image
processing procedures and lists
configuration options.
JPEG Image Compressor
The HDCP-2000 includes a fully
configured JPEG image compres-
sion function. Using internally
stored quantization and Huffman
code tables, the JPEG function
compresses and outputs processed
image data. The HDCP-2000 can
automatically (auto Q adjust
function) or manually scale the
quantization tables to optimize
image quality while maintaining
acceptable frame transmission
rates over the chip’s USB bus.
HDCP-2000
Image Processor
Agilent CMOS
Image Sensor
HDCP-2000 to Image
Sensor 2 Wire Serial
Control Interface
JPEG Image Compressor
USB 1.1 Host Interface
PC or other
USB Device
General Purpose
Input/Output Pins
2
Image data from sensor
Operation
Collect image statistics such as peak
values, pixel sums, and histograms on
a one-to-many frame basis.
Settings/Options
Initialize and configure the statistics
functions via the STAT_CAP_CTRL and
STAT_MODE_CTRL registers. See
discussion of statisitics functions for
descriptions of outputs.
Enable/disable and monitor via
AEWB_AUTO and AEWB_STATUS
registers. See discussion of auto-exposure
and auto white balance functions for
descriptions of configuration registers.
On/off via CFG_MAIN2 register.
Statistics
Auto-exposure and
white balance
Auto exposure; adjust sensor gain and
exposure time to meet target pixel
luminance.
Auto white balance; equalize average
pixel luminance among color bands.
Convert raw Bayer pattern pixel data
into red, green, and blue image planes.
Demosaic
Color correction
Adjust for the color filter response of
the image sensor.
Use default or custom color correction
matrices.
Gamma correction
Apply non-linear transfer function to
image data.
Select bottom-weighted or linear lookup
table via CFG_MAIN1 register. Use
default or custom table.
Color space conversion
Convert RGB data to desired color
space.
Use default (RGB to YUV) or custom
conversion matrices. The conversion to
YUV color space prepares the data for
down sampling and JPEG compression.
Down sampling
Reduce resolution of chrominance data
to compress data.
Select down sampling mode (grayscale,
444 or 422) via CFG_MAIN1 register.
output sign control
Change sign bit of output bytes (function
disabled when the HDCP-2010’s JPEG
function is used).
Select mode via CFG_MAIN2 register.
JPEG Compression
Baseline JPEG compression for grayscale,
444, or 422 modes.
Restart markers, quantization tables and
Huffman tables are programmable.
Figure 1. Overview of Image Processing Operations.
3
USB Host Interface
Coupled with the HDCP-2000’s
USB drivers, the isochronous USB
host interface transmits processed
image frames and provides
read/write access to the chip’s
registers and RAMs. The
HDCP-2000 uses even-numbered
RAM and register addresses. Each
address specifies a memory word,
and single byte read/write opera-
tions are not allowed. The
HDCP-2000’s “auto Q adjust”
function will dynamically scale
JPEG quantization factors to adjust
for differences in data transmission
rate over the USB bus.
HDCP-2000 to Image Sensor Two
Wire Serial Control Interface
The HDCP-2000 uses a two-wire
serial control interface for config-
uring Agilent Technologies CMOS
image sensors. External devices
can transmit register values to or
from the image sensor by writing
to registers in the HDCP-2000.
Two registers store the data and
one register stores the address of
the destination/source register
(the register to write to or read
from in the image sensor). A
fourth register controls the
direction of transmission and
initiates the read/write operation.
General Purpose Input/Output Pins
Two general purpose input/output
(GPIO) pins are included. Poten-
tial applications include driving
LEDs or polling a shutter button.
The pins can sink or source 8mA
of power. The GPIO register
controls both pins and stores the
input/output data.
Pin Layout
The HDCP-2000 uses a 64-lead
MQFP package.
Gnd
Gnd
Gnd Sensor_nRow
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
Sensor_clock
Mode_select[0]
Mode_select[1]
Mode_select[2]
Reserve/NO CONNECT
VddA_1.8V
Vdd_1.8V
Crystal_output
Crystal_input
GPIO_1
Vdd_3.3V
Sensor_data[0]
Sensor_data[2]
Sensor_data[4]
Sensor_data[6]
Sensor_data[8]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Sensor_nReset
Sensor_data_ready
Sensor_nFrame
Sensor_TWIN_data
nPOR
Sensor_TWIN_clock
Vdd_1.8V
GPIO_0
Vdd_3.3V
USB_plus
USB_minus
Sensor_data[1]
Sensor_data[3]
Sensor_data[5]
Sensor_data[7]
Sensor_data[9]
Figure 2. Package Layout.
4
MQFP Package Outline
D
1[5,6]
D
1[3]
D
2
4X
[3]
0.25 C A–B D
Z
D
D
E
1[5,6]
A
[3]
E
2
B
[3]
4X
e
Z
E
BOTTOM VIEW
See Detail “A”
TOP VIEW
ODD LEAD SIDES
0.20 C A–B D
E
[3]
A, B, D
[3]
12–16°
1.41 REF
See
Detail “B”
A
H
[2]
0.076
C
12–16°
A
1
1.60 REF
DETAIL “B”
DETAIL “A”
C
L
A, B, D
[3]
A
2
– 0.10 S
C
EVEN LEAD SIDES
e/2
Notes:
1. All dimensions and tolerances conform to ANSI Y145-1982.
2. Datum plane H located at mold parting line and coincident with lead,
where lead exits plastic body at bottom of parting line.
3. Datums A–B and D to be determined where centerline between leads
exits plastic body at datum plane H.
4. To be determined at seating plane C.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold
protrusion is 0.254 mm per side. Dimensions D1 and E1 do
include mold mismatch and are determined at datum plane H.
6. Package top dimensions are smaller than bottom dimensions by
0.20 mm, and top of package will not overhang bottom of package.
7. All dimensions are in millimeters.
SYMBOL
A
A
1
A
2
D
D
1
D
2
Z
D
E
E
1
E
2
Z
E
L
e
b
b
1
ccc
VARIATIONS
MIN. NOM.
2.82
0.10
0.15
2.55
2.67
17.20 BSC
14.00 BSC
12.00 BSC
1.00 REF
17.20 BSC
14.00 BSC
12.00 BSC
1.00 REF
0.73
0.88
0.80 BSC
0.30
0.30
0.35
0.16
MAX.
3.00
0.25
2.75
1.03
5
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