IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-16, FF/Latch
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Toshiba(东芝) |
零件包装代码 | SOIC |
包装说明 | LSSOP, |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | LVQ |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 5 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 6 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 |
传播延迟(tpd) | 13 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 4.4 mm |
最小 fmax | 70 MHz |
TC74LVQ174FSELP | TC74LVQ174FSEL | TC74LVQ174FNELP | TC74LVQ174FNEL | TC74LVQ174FELP | TC74LVQ174FEL | TC74LVQ174F | |
---|---|---|---|---|---|---|---|
描述 | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-16, FF/Latch | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-16, FF/Latch | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.150 INCH, PLASTIC, MS-012AC, SOP-16, FF/Latch | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.150 INCH, PLASTIC, MS-012AC, SOP-16, FF/Latch | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-16, FF/Latch | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-16, FF/Latch | IC LVQ SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-16, FF/Latch |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | LSSOP, | 0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-16 | SOP, | SOP, | SOP, | SOP, | SOP, SOP16,.3 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 6 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LSSOP | LSSOP | SOP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
系列 | LVQ | LVQ | LVQ | LVQ | LVQ | LVQ | - |
JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 |
长度 | 5 mm | 5 mm | 9.9 mm | 9.9 mm | 10.3 mm | 10.3 mm | - |
位数 | 6 | 6 | 6 | 6 | 6 | 6 | - |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 | - |
传播延迟(tpd) | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns | - |
座面最大高度 | 1.6 mm | 1.6 mm | 1.75 mm | 1.75 mm | 1.9 mm | 1.9 mm | - |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - |
端子面层 | TIN LEAD | TIN LEAD | - | - | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 4.4 mm | 4.4 mm | 3.9 mm | 3.9 mm | 5.3 mm | 5.3 mm | - |
最小 fmax | 70 MHz | 70 MHz | 70 MHz | 70 MHz | 70 MHz | 70 MHz | - |
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