800-mA, 3-MHz High-Efficiency Step-Down Converter. 3.0V fixed Output voltage. 6-DSBGA -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | VFBGA, |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
其他特性 | ALSO OPERATES IN PFM CONTROL TECHNIQUE |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR |
控制模式 | VOLTAGE-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 4.8 V |
最小输入电压 | 2.3 V |
标称输入电压 | 3.6 V |
JESD-30 代码 | R-XBGA-B6 |
JESD-609代码 | e1 |
长度 | 1.3 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 6 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出电流 | 0.8 A |
最大输出电压 | 3 V |
最小输出电压 | 3 V |
标称输出电压 | 3 V |
封装主体材料 | UNSPECIFIED |
封装代码 | VFBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
座面最大高度 | 0.4 mm |
表面贴装 | YES |
切换器配置 | BUCK |
最大切换频率 | 3000 kHz |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.4 mm |
端子位置 | BOTTOM |
宽度 | 0.926 mm |
TPS62698YFDT | TPS62693YFDR | TPS62693YFDT | TPS62698YFDR | |
---|---|---|---|---|
描述 | 800-mA, 3-MHz High-Efficiency Step-Down Converter. 3.0V fixed Output voltage. 6-DSBGA -40 to 85 | 800-mA, 3-MHz High-Efficiency Step-Down Converter, TPS6269x 6-DSBGA -40 to 85 | 800-mA, 3-MHz High-Efficiency Step-Down Converter, TPS6269x 6-DSBGA -40 to 85 | 800-mA, 3-MHz High-Efficiency Step-Down Converter. 3.0V fixed Output voltage. 6-DSBGA -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
包装说明 | VFBGA, | VFBGA, | VFBGA, | VFBGA, |
Reach Compliance Code | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 6 weeks | 1 week | 6 weeks | 6 weeks |
其他特性 | ALSO OPERATES IN PFM CONTROL TECHNIQUE | ALSO OPERATES IN PFM CONTROL TECHNIQUE | ALSO OPERATES IN PFM CONTROL TECHNIQUE | ALSO OPERATES IN PFM CONTROL TECHNIQUE |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR |
控制模式 | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 4.8 V | 4.8 V | 4.8 V | 4.8 V |
最小输入电压 | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称输入电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
JESD-30 代码 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 |
JESD-609代码 | e1 | e1 | e1 | e1 |
长度 | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 6 | 6 | 6 | 6 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
最大输出电流 | 0.8 A | 0.8 A | 0.8 A | 0.8 A |
最大输出电压 | 3 V | 2.85 V | 2.85 V | 3 V |
最小输出电压 | 3 V | 2.85 V | 2.85 V | 3 V |
标称输出电压 | 3 V | 2.85 V | 2.85 V | 3 V |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | VFBGA | VFBGA | VFBGA | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
座面最大高度 | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
表面贴装 | YES | YES | YES | YES |
切换器配置 | BUCK | BUCK | BUCK | BUCK |
最大切换频率 | 3000 kHz | 3000 kHz | 3000 kHz | 3000 kHz |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | BALL | BALL | BALL |
端子节距 | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 0.926 mm | 0.926 mm | 0.926 mm | 0.926 mm |
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