Enhanced Product 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References 6-SOT-23 -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOT-23 |
| 包装说明 | LSSOP, TSOP6,.11,37 |
| 针数 | 6 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G6 |
| JESD-609代码 | e4 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电流 | 0.01 A |
| 最大输出电压 | 2.505 V |
| 最小输出电压 | 2.495 V |
| 标称输出电压 | 2.5 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电流 (Isup) | 0.12 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.55 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 最大电压温度系数 | 40 ppm/°C |
| 温度等级 | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 微调/可调输出 | NO |
| 最大电压容差 | 0.2% |
| 宽度 | 1.6 mm |
| Base Number Matches | 1 |
| REF3225AMDBVREP | REF3240AMDBVREP | REF3230AMDBVREP | REF3212AMDBVREP | REF3220AMDBVREP | |
|---|---|---|---|---|---|
| 描述 | Enhanced Product 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References 6-SOT-23 -55 to 125 | Enhanced Product 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References 6-SOT-23 -55 to 125 | Enhanced Product 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References 6-SOT-23 -55 to 125 | Enhanced Product 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References 6-SOT-23 -55 to 125 | Enhanced Product 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References 6-SOT-23 -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 |
| 包装说明 | LSSOP, TSOP6,.11,37 | LSSOP, TSOP6,.11,37 | LSSOP, TSOP6,.11,37 | LSSOP, TSOP6,.11,37 | LSSOP, TSOP6,.11,37 |
| 针数 | 6 | 6 | 6 | 6 | 6 |
| Reach Compliance Code | compli | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 最大输出电压 | 2.505 V | 4.104 V | 3.006 V | 1.2525 V | 2.052 V |
| 最小输出电压 | 2.495 V | 4.088 V | 2.994 V | 1.2475 V | 2.044 V |
| 标称输出电压 | 2.5 V | 4.096 V | 3 V | 1.25 V | 2.048 V |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP |
| 封装等效代码 | TSOP6,.11,37 | TSOP6,.11,37 | TSOP6,.11,37 | TSOP6,.11,37 | TSOP6,.11,37 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm |
| 最大供电电流 (Isup) | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.55 V | 4.146 V | 3.05 V | 1.8 V | 2.098 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 最大电压温度系数 | 40 ppm/°C | 40 ppm/°C | 40 ppm/°C | 40 ppm/°C | 40 ppm/°C |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 微调/可调输出 | NO | NO | NO | NO | NO |
| 最大电压容差 | 0.2% | 0.2% | 0.2% | 0.2% | 0.2% |
| 宽度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大输出电流 | 0.01 A | 0.01 A | 0.01 A | - | 0.01 A |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Factory Lead Time | - | 6 weeks | 6 weeks | 6 weeks | 12 weeks |
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