Flash, 1MX8, 120ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40
| 参数名称 | 属性值 |
| 零件包装代码 | TSOP1 |
| 包装说明 | 10 X 20 MM, PLASTIC, TSOP1-40 |
| 针数 | 40 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| 其他特性 | TOP BOOT BLOCK |
| 备用内存宽度 | 16 |
| 启动块 | TOP |
| JESD-30 代码 | R-PDSO-G40 |
| JESD-609代码 | e3 |
| 长度 | 18.4 mm |
| 内存密度 | 8388608 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 类型 | NOR TYPE |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| MT28F008B3VG-12TVET | MT28F008B3VG-12BVET | MT28F800B3SG-12TVET | MT28F800B3SG-12BVET | MT28F800B3WG-12BVET | MT28F800B3WG-12TVET | MT28F800B3FB-12BVET | MT28F800B3FB-12TVET | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 1MX8, 120ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40 | Flash, 1MX8, 120ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40 | Flash, 1MX8, 120ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 120ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 120ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | Flash, 1MX8, 120ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | Flash, 1MX8, 120ns, PBGA48, 0.80 MM PITCH, FBGA-48 | Flash, 1MX8, 120ns, PBGA48, 0.80 MM PITCH, FBGA-48 |
| 零件包装代码 | TSOP1 | TSOP1 | SOIC | SOIC | TSOP1 | TSOP1 | BGA | BGA |
| 包装说明 | 10 X 20 MM, PLASTIC, TSOP1-40 | 10 X 20 MM, PLASTIC, TSOP1-40 | 0.600 INCH, PLASTIC, SOP-44 | 0.600 INCH, PLASTIC, SOP-44 | 12 X 20 MM, PLASTIC, TSOP1-48 | 12 X 20 MM, PLASTIC, TSOP1-48 | 0.80 MM PITCH, FBGA-48 | 0.80 MM PITCH, FBGA-48 |
| 针数 | 40 | 40 | 44 | 44 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns |
| 其他特性 | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 启动块 | TOP | BOTTOM | TOP | BOTTOM | BOTTOM | TOP | BOTTOM | TOP |
| JESD-30 代码 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B48 | R-PBGA-B48 |
| 内存密度 | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 44 | 44 | 48 | 48 | 48 | 48 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1 | SOP | SOP | TSOP1 | TSOP1 | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 2.7 mm | 2.7 mm | 1.2 mm | 1.2 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| JESD-609代码 | e3 | e3 | - | - | e3 | e3 | e1 | e1 |
| 长度 | 18.4 mm | 18.4 mm | 28.195 mm | 28.195 mm | 18.4 mm | 18.4 mm | - | - |
| 端子面层 | MATTE TIN | MATTE TIN | - | - | MATTE TIN | MATTE TIN | TIN SILVER COPPER | TIN SILVER COPPER |
| 宽度 | 10 mm | 10 mm | 12.6 mm | 12.6 mm | 12 mm | 12 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
嵌入式系统
stm32/stm8
DSP 与 ARM 处理器
嵌入式系统
stm32/stm8
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